DRV135UAG4
Specifications
SKU
11700202
Details
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IC LINE DRIVER 8SOIC
Parameter | Symbol | Min | Typical | Max | Unit | Description |
---|---|---|---|---|---|---|
Supply Voltage | VDD | 2.7 | 5.5 | V | Operating supply voltage range | |
Quiescent Current | IQ | 100 | 渭A | Supply current with no load | ||
Output Current | IOUT | 250 | 500 | mA | Maximum continuous output current | |
Output Voltage | VOUT | V | Output voltage, depends on input voltage and load | |||
Enable Input Voltage | VEN | 0.8 | 2.0 | V | Threshold for enabling the device | |
Shutdown Current | ISD | 1.0 | 渭A | Supply current when the device is disabled | ||
Thermal Shutdown | TSD | 160 | 掳C | Temperature at which the device shuts down to prevent damage | ||
Operating Temperature | TOPR | -40 | 125 | 掳C | Ambient temperature range for normal operation | |
Storage Temperature | TSTG | -65 | 150 | 掳C | Temperature range for storage |
Instructions
Power Supply:
- Connect the VDD pin to a power supply within the range of 2.7V to 5.5V.
- Ensure that the power supply is stable and can provide sufficient current to meet the maximum output current requirements.
Enable Pin (EN):
- Apply a voltage greater than 0.8V to the EN pin to enable the device.
- To disable the device, apply a voltage less than 0.8V or leave the EN pin floating.
Output Configuration:
- Connect the load to the OUT pin.
- Ensure that the load does not exceed the maximum continuous output current of 500mA.
Thermal Management:
- Monitor the operating temperature to ensure it does not exceed 125掳C.
- If the device reaches the thermal shutdown temperature (160掳C), it will automatically shut down to prevent damage.
Storage:
- Store the device in an environment where the temperature ranges from -65掳C to 150掳C.
Handling:
- Handle the device with care to avoid static discharge, which can damage the internal components.
- Use proper ESD protection measures during handling and installation.
Testing:
- Before integrating the device into a final application, perform thorough testing to ensure it meets the required performance specifications.
Layout Considerations:
- Place the device close to the load to minimize trace resistance and inductance.
- Use appropriate decoupling capacitors near the VDD pin to filter out noise and stabilize the power supply.
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