Details
BUY SN75140P https://www.utsource.net/itm/p/11714867.html
IC RECEIVER 0/2 8DIP
| Parameter | Symbol | Conditions | Min | Typical | Max | Unit |
|---|---|---|---|---|---|---|
| Supply Voltage | VCC | Operating | 4.5 | - | 5.5 | V |
| Output Current | IO | Continuous | - | 20 | - | mA |
| Output Voltage (High) | VOH | IO = -4.4mA | 2.4 | - | 3.6 | V |
| Output Voltage (Low) | VOL | IO = 16mA | 0.4 | - | 0.5 | V |
| Input Voltage (High) | VIH | - | 2.0 | - | 5.5 | V |
| Input Voltage (Low) | VIL | - | 0 | - | 0.8 | V |
| Propagation Delay Time | tpd | - | 22 | - | 45 | ns |
| Power Dissipation | PD | Maximum | - | - | 350 | mW |
| Operating Temperature Range | TA | - | -40 | - | 85 | °C |
| Storage Temperature Range | TSTG | - | -65 | - | 150 | °C |
Instructions for Using SN75140P
Power Supply:
- Ensure the supply voltage (VCC) is within the range of 4.5V to 5.5V.
- Connect the ground (GND) pin to a stable ground reference.
Input Signals:
- Apply input signals (VIH and VIL) within the specified ranges to avoid damage or incorrect operation.
- Use appropriate pull-up or pull-down resistors if necessary to ensure stable input levels.
Output Configuration:
- The output pins can source or sink up to 20mA continuously.
- Ensure the load connected to the output pins does not exceed the maximum current rating.
- Use external resistors or other components to limit current if necessary.
Propagation Delay:
- Account for the propagation delay time (tpd) in your circuit design, especially in high-speed applications.
Thermal Management:
- Ensure adequate heat dissipation if the device is operating near its maximum power dissipation (PD).
- Use a heatsink or other cooling methods if required.
Temperature Considerations:
- Operate the device within the specified temperature range (TA) to ensure reliable performance.
- Store the device within the storage temperature range (TSTG) to prevent damage.
Handling:
- Handle the device with care to avoid static discharge and physical damage.
- Follow proper ESD (Electrostatic Discharge) precautions when handling the device.
Testing:
- Perform initial testing at room temperature and gradually test under different conditions to ensure robust operation.
- Verify all connections and parameters before finalizing the design.
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