Details

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BUY SSP2N60B https://www.utsource.net/itm/p/11716927.html

Parameter	Symbol	Min	Typ	Max	Unit	Conditions
Drain-Source Voltage	VDS	-	-	600	V
Gate-Source Voltage	VGS	-15	-	15	V
Continuous Drain Current	ID	-	2	-	A	TC = 25掳C
Pulse Drain Current	ID(peak)	-	8	-	A	tp = 10ms, TC = 25掳C
Power Dissipation	PD	-	-	75	W	TC = 25掳C
Junction Temperature	TJ	-	-	150	掳C
Storage Temperature	TSTG	-55	-	150	掳C

Instructions for Use:

1. Handling Precautions:

   • Handle the SSP2N60B with care to avoid mechanical damage.
   • Use proper ESD (Electrostatic Discharge) protection when handling the device.

2. Mounting and Soldering:

   • Ensure that the mounting surface is clean and free of contaminants.
   • Use recommended soldering temperatures and times to avoid thermal shock.
   • Allow the device to cool down naturally after soldering.

3. Operating Conditions:

   • Do not exceed the maximum ratings specified in the table.
   • Ensure adequate heat dissipation to maintain the junction temperature within safe limits.
   • Use appropriate cooling methods such as heatsinks or forced air cooling if necessary.

4. Storage:

   • Store the device in a dry, cool place away from direct sunlight.
   • Keep the device in its original packaging until ready for use.

5. Testing:

   • Use appropriate test equipment and procedures to ensure accurate measurements.
   • Follow safety guidelines when testing high-voltage components.

6. Applications:

   • The SSP2N60B is suitable for a wide range of applications including power supplies, motor control, and switching circuits.
   • Ensure that the device is used within its specified parameters for optimal performance and reliability.

(For reference only)