Details

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BUY DM7445N https://www.utsource.net/itm/p/11720255.html
IC DECODER/DRIVER BCD-DEC 16-DIP

Parameter	Symbol	Conditions	Min	Typ	Max	Unit
Supply Voltage	VCC	Operating	4.75	5.0	5.25	V
Input Voltage (High Level)	VIH	Input High Level	3.15	-	5.25	V
Input Voltage (Low Level)	VIL	Input Low Level	0	-	2.0	V
Output Voltage (High Level)	VOH	Output High Level, IO = -0.4 mA	2.4	-	5.0	V
Output Voltage (Low Level)	VOL	Output Low Level, IO = 16 mA	0	-	0.5	V
Input Current (High Level)	IIH	Input High Level	-20	-	-	μA
Input Current (Low Level)	IIL	Input Low Level	-100	-	-	μA
Output Current (Source)	IOH	Output High Level	-	-	0.4	mA
Output Current (Sink)	IOL	Output Low Level	-	-	16	mA
Propagation Delay Time	tpd	VCC = 5V, TA = 25°C	-	22	-	ns
Power Dissipation	PD	Maximum at TA = 70°C	-	-	100	mW

Instructions for Use:

1. Power Supply:

   • Ensure the supply voltage (V_CC) is within the specified range of 4.75V to 5.25V.
   • Connect the ground (GND) pin to a stable 0V reference.

2. Input Signals:

   • For a high input level, the voltage should be between 3.15V and 5.25V.
   • For a low input level, the voltage should be between 0V and 2.0V.
   • Ensure the input current does not exceed -20 μA for high levels and -100 μA for low levels.

3. Output Signals:

   • The output high level (V_OH) should be between 2.4V and 5.0V when sourcing up to 0.4 mA.
   • The output low level (V_OL) should be between 0V and 0.5V when sinking up to 16 mA.

4. Propagation Delay:

   • The propagation delay time (t_pd) is typically 22 ns at V_CC = 5V and T_A = 25°C.

5. Power Dissipation:

   • The maximum power dissipation (P_D) is 100 mW at an ambient temperature of 70°C.

6. Operating Temperature:

   • The device is designed to operate within a temperature range that supports the specified parameters. Ensure the operating environment is within this range to avoid damage or performance degradation.

7. Handling:

   • Handle the DM7445N with care to avoid static discharge, which can damage the internal circuitry.
   • Use appropriate ESD protection measures during handling and installation.

8. Mounting:

   • Ensure proper mounting and soldering techniques to avoid mechanical stress on the pins and ensure reliable electrical connections.

9. Storage:

   • Store the device in a dry, cool place away from direct sunlight and sources of heat.

(For reference only)