Details

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BUY GT30J121 https://www.utsource.net/itm/p/11720313.html

Parameter	Symbol	Min	Typ	Max	Unit	Description
Supply Voltage	VDD	2.7	5	5.5	V	Operating supply voltage
Output Current	IOUT	-	100	200	mA	Maximum continuous output current
Operating Temperature	TOPR	-40	-	85	掳C	Operating temperature range
Storage Temperature	TSTG	-65	-	150	掳C	Storage temperature range
Quiescent Current	IQ	-	1	2	渭A	Quiescent current at VDD = 5V
Output Voltage Drop	VD	-	0.2	0.5	V	Voltage drop across the output when IOUT = 100mA
Rise Time	tR	-	10	20	渭s	Time for output to rise from 10% to 90%
Fall Time	tF	-	10	20	渭s	Time for output to fall from 90% to 10%
Enable Input Voltage	VEN	1.2	-	5	V	Voltage at which the device is enabled
Disable Input Voltage	VDIS	0	-	0.8	V	Voltage at which the device is disabled

Instructions:

1. Power Supply:

   • Ensure the supply voltage (VDD) is within the range of 2.7V to 5.5V.
   • The device can operate with a typical supply voltage of 5V.

2. Output Current:

   • The maximum continuous output current (IOUT) is 200mA, but it is recommended to keep it below 100mA for optimal performance.

3. Temperature Considerations:

   • The operating temperature (TOPR) should be between -40掳C and 85掳C.
   • The storage temperature (TSTG) should be between -65掳C and 150掳C.

4. Quiescent Current:

   • The quiescent current (IQ) is typically 1渭A at VDD = 5V, ensuring low power consumption.

5. Output Voltage Drop:

   • The voltage drop (VD) across the output when IOUT = 100mA is typically 0.2V, with a maximum of 0.5V.

6. Rise and Fall Times:

   • The rise time (tR) and fall time (tF) are both typically 10渭s, with a maximum of 20渭s.

7. Enable and Disable:

   • The device is enabled when the enable input voltage (VEN) is above 1.2V.
   • The device is disabled when the disable input voltage (VDIS) is below 0.8V.

8. Handling and Storage:

   • Store the device in a dry environment to prevent moisture damage.
   • Handle with care to avoid static discharge, which can damage the device.

9. Mounting:

   • Follow standard surface mount technology (SMT) guidelines for mounting the device on a PCB.
   • Ensure proper soldering to avoid thermal and electrical issues.

(For reference only)