Details

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BUY DS90LV047ATM https://www.utsource.net/itm/p/11721486.html
IC LINE DRIVER 4/0 CMOS 16SOIC

Parameter	Symbol	Min	Typical	Max	Unit	Conditions
Supply Voltage	Vcc	2.7	3.3	5.5	V	-
Differential Input Voltage	Vin	-0.3	0	0.3	V	-
Output High Voltage	VoH	2.4		Vcc	V	Io = -4mA
Output Low Voltage	VoL	0		0.4	V	Io = 4mA
Propagation Delay	tpd		1.8		ns	Vcc = 3.3V, CL = 15pF
Skew	tskew		0.2		ns	Vcc = 3.3V, CL = 15pF
Power Consumption	Pd		100		mW	Vcc = 3.3V, f = 100MHz
Operating Temperature	Toper	-40		85	°C	-
Storage Temperature	Tstg	-65		150	°C	-

Instructions for DS90LV047ATM

1. Power Supply:

   • Ensure the supply voltage (Vcc) is within the range of 2.7V to 5.5V.
   • Use a stable power supply to avoid fluctuations that can affect performance.

2. Input Signals:

   • The differential input voltage (Vin) should be between -0.3V and 0.3V relative to ground.
   • Avoid exceeding these limits to prevent damage to the device.

3. Output Signals:

   • The output high voltage (VoH) should be at least 2.4V when the load current (Io) is -4mA.
   • The output low voltage (VoL) should not exceed 0.4V when the load current (Io) is 4mA.

4. Propagation Delay and Skew:

   • The typical propagation delay (tpd) is 1.8ns under standard conditions (Vcc = 3.3V, CL = 15pF).
   • The skew (tskew) is typically 0.2ns under the same conditions.
   • These parameters are crucial for maintaining signal integrity in high-speed applications.

5. Power Consumption:

   • The power consumption (Pd) is typically 100mW at Vcc = 3.3V and a frequency (f) of 100MHz.
   • Consider thermal management if operating at higher frequencies or in high-temperature environments.

6. Temperature Range:

   • The operating temperature (Toper) range is from -40°C to 85°C.
   • The storage temperature (Tstg) range is from -65°C to 150°C.
   • Ensure the device is stored and operated within these temperature limits to avoid damage.

7. Handling:

   • Handle the device with care to avoid static discharge, which can damage sensitive components.
   • Follow proper ESD (Electrostatic Discharge) precautions during handling and installation.

8. Mounting:

   • Ensure proper mounting and soldering techniques to avoid mechanical stress on the device.
   • Use appropriate soldering temperatures and profiles to prevent damage during assembly.

9. Testing:

   • Perform initial testing under controlled conditions to verify functionality.
   • Regularly test the device to ensure it continues to meet performance specifications over time.

10. Documentation:

    • Refer to the datasheet and application notes for detailed information and specific use cases.
    • Keep documentation readily available for reference during design and troubleshooting.

(For reference only)