AM26LS32ACNSR
Specifications
SKU
11723218
Details
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IC RECEIVER 0/4 16SO
| Parameter | Description | Min | Typ | Max | Unit |
|---|---|---|---|---|---|
| Supply Voltage (Vcc) | Operating supply voltage | 4.5 | - | 5.5 | V |
| Output Drive Current (IOH) | Output high-level current | - | - | -400 | mA |
| Output Drive Current (IOL) | Output low-level current | -400 | - | - | mA |
| Input Leakage Current (IIH) | High-level input leakage current | - | - | 1 | μA |
| Input Leakage Current (IIL) | Low-level input leakage current | - | - | 1 | μA |
| Propagation Delay Time (tPLH) | Low-to-high propagation delay time | 9 | - | 22 | ns |
| Propagation Delay Time (tPHL) | High-to-low propagation delay time | 9 | - | 22 | ns |
| Power Dissipation (PD) | Maximum power dissipation | - | - | 1000 | mW |
| Operating Temperature Range (TA) | Ambient operating temperature range | -40 | - | 85 | °C |
| Storage Temperature Range (TSTG) | Storage temperature range | -65 | - | 150 | °C |
Instructions for Use:
Supply Voltage:
- Ensure the supply voltage (Vcc) is within the range of 4.5V to 5.5V to avoid damage to the device.
Output Drive Current:
- The device can sink up to 400mA (IOL) and source up to 400mA (IOH). Design your circuit to ensure these limits are not exceeded.
Input Leakage Current:
- The input leakage current (IIH and IIL) should be kept below 1μA to maintain proper operation.
Propagation Delay:
- The propagation delay times (tPLH and tPHL) are critical for timing considerations in your design. They should be within 9ns to 22ns.
Power Dissipation:
- The maximum power dissipation (PD) is 1000mW. Ensure adequate heat dissipation to prevent overheating.
Operating Temperature:
- The ambient operating temperature (TA) should be between -40°C and 85°C.
Storage Temperature:
- When storing the device, keep it within the temperature range of -65°C to 150°C to prevent damage.
Handling:
- Handle the device with care to avoid static discharge, which can damage sensitive components. Use appropriate ESD protection measures.
Mounting:
- Follow the recommended soldering profile and mounting guidelines to ensure reliable performance and longevity.
Testing:
- Before finalizing the design, test the device under various conditions to ensure it meets the required specifications and performance criteria.
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