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BUY 74F257APC https://www.utsource.net/itm/p/11724394.html
IC MULTIPLEXER QUAD 2INP 16-DIP
Parameter | Description | Min | Typ | Max | Unit |
---|---|---|---|---|---|
Supply Voltage (Vcc) | Operating supply voltage range | 4.75 | - | 5.25 | V |
Output Drive Current (IOH) | Output high-level current at Vcc = 5V, VO = 2.4V | - | - | 16 | mA |
Output Sink Current (IOL) | Output low-level current at Vcc = 5V, VO = 0.4V | - | - | 24 | mA |
Input Leakage Current (II) | Input leakage current at Vcc = 5V | - | - | 1.0 | μA |
Propagation Delay Time (tpd) | Propagation delay time from input to output | - | 5 | 9 | ns |
Power Dissipation (PD) | Maximum power dissipation | - | - | 330 | mW |
Operating Temperature Range (Toper) | Operating temperature range | -40 | - | 85 | °C |
Storage Temperature Range (Tstg) | Storage temperature range | -65 | - | 150 | °C |
Instructions for Use:
Power Supply:
- Ensure the supply voltage (Vcc) is within the specified range of 4.75V to 5.25V.
- Connect the ground (GND) pin to a stable 0V reference.
Input Signals:
- Apply logic levels (0V or 5V) to the input pins.
- Ensure input signals do not exceed the supply voltage or go below ground level to avoid damage.
Output Signals:
- The output pins can source up to 16mA and sink up to 24mA.
- Ensure the load connected to the output does not exceed these current limits.
Propagation Delay:
- The propagation delay time (tpd) is typically 5ns with a maximum of 9ns. This should be considered in timing-sensitive applications.
Temperature Considerations:
- The device operates reliably within the temperature range of -40°C to 85°C.
- Store the device in a temperature range of -65°C to 150°C when not in use.
Power Dissipation:
- Ensure the total power dissipation does not exceed 330mW to prevent overheating and potential damage.
Handling:
- Handle the device with care to avoid static discharge, which can damage sensitive components.
- Use proper anti-static precautions when handling and soldering the device.
Mounting:
- Ensure the device is securely mounted on the PCB to avoid mechanical stress.
- Follow recommended soldering profiles to ensure reliable connections.
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