74F257APC

74F257APC

Category: IC Chips

Specifications
SKU
11724394
Details

BUY 74F257APC https://www.utsource.net/itm/p/11724394.html
IC MULTIPLEXER QUAD 2INP 16-DIP
Parameter Description Min Typ Max Unit
Supply Voltage (Vcc) Operating supply voltage range 4.75 - 5.25 V
Output Drive Current (IOH) Output high-level current at Vcc = 5V, VO = 2.4V - - 16 mA
Output Sink Current (IOL) Output low-level current at Vcc = 5V, VO = 0.4V - - 24 mA
Input Leakage Current (II) Input leakage current at Vcc = 5V - - 1.0 μA
Propagation Delay Time (tpd) Propagation delay time from input to output - 5 9 ns
Power Dissipation (PD) Maximum power dissipation - - 330 mW
Operating Temperature Range (Toper) Operating temperature range -40 - 85 °C
Storage Temperature Range (Tstg) Storage temperature range -65 - 150 °C

Instructions for Use:

  1. Power Supply:

    • Ensure the supply voltage (Vcc) is within the specified range of 4.75V to 5.25V.
    • Connect the ground (GND) pin to a stable 0V reference.
  2. Input Signals:

    • Apply logic levels (0V or 5V) to the input pins.
    • Ensure input signals do not exceed the supply voltage or go below ground level to avoid damage.
  3. Output Signals:

    • The output pins can source up to 16mA and sink up to 24mA.
    • Ensure the load connected to the output does not exceed these current limits.
  4. Propagation Delay:

    • The propagation delay time (tpd) is typically 5ns with a maximum of 9ns. This should be considered in timing-sensitive applications.
  5. Temperature Considerations:

    • The device operates reliably within the temperature range of -40°C to 85°C.
    • Store the device in a temperature range of -65°C to 150°C when not in use.
  6. Power Dissipation:

    • Ensure the total power dissipation does not exceed 330mW to prevent overheating and potential damage.
  7. Handling:

    • Handle the device with care to avoid static discharge, which can damage sensitive components.
    • Use proper anti-static precautions when handling and soldering the device.
  8. Mounting:

    • Ensure the device is securely mounted on the PCB to avoid mechanical stress.
    • Follow recommended soldering profiles to ensure reliable connections.
(For reference only)

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