Details
BUY STP80NF55-08 https://www.utsource.net/itm/p/11725125.html
| Parameter | Symbol | Min | Typ | Max | Unit | Notes |
|---|---|---|---|---|---|---|
| Drain-Source Voltage | VDS | -55 | - | - | V | |
| Gate-Source Voltage | VGS | -15 | - | 15 | V | |
| Continuous Drain Current | ID | - | - | 80 | A | @ TC = 25°C |
| Pulse Drain Current | IDM | - | - | 160 | A | tp = 10 μs, IGT = 4 A |
| Power Dissipation | PTOT | - | - | 150 | W | @ TC = 25°C |
| Junction Temperature | TJ | - | - | 175 | °C | |
| Storage Temperature | TSTG | -55 | - | 175 | °C |
Instructions for Use:
Handling Precautions:
- The STP80NF55-08 is sensitive to electrostatic discharge (ESD). Use proper ESD protection when handling the device.
- Avoid mechanical stress on the leads and the body of the device.
Mounting:
- Ensure that the mounting surface is flat and clean to ensure good thermal contact.
- Use a suitable thermal compound or pad to enhance heat dissipation.
- Torque the mounting screws to the recommended values to avoid over-tightening and potential damage.
Operating Conditions:
- Do not exceed the maximum ratings listed in the table.
- Ensure adequate cooling to keep the junction temperature within the specified limits.
- For continuous operation, ensure that the power dissipation does not exceed the rated value at the given ambient temperature.
Gate Drive:
- Apply a gate-source voltage (VGS) between 10V and 15V for optimal performance.
- Ensure that the gate drive circuitry can provide sufficient current to charge and discharge the gate capacitance quickly.
Thermal Management:
- Use a heatsink with sufficient thermal capacity to maintain the junction temperature below the maximum rating.
- Consider forced air cooling or other cooling methods if natural convection is insufficient.
Storage:
- Store the device in a dry, cool place away from direct sunlight and corrosive environments.
- Follow the storage temperature range specified to prevent damage.
Testing:
- When testing the device, use appropriate test equipment and follow safety guidelines to avoid damage to the device or injury to personnel.
For more detailed information, refer to the datasheet provided by STMicroelectronics.
(For reference only)View more about STP80NF55-08 on main site
