Details

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BUY W9864G2GH-6 https://www.utsource.net/itm/p/11728654.html

Parameter	Description	Value
Device Type	High-Density NAND Flash Memory	-
Memory Size	Storage Capacity	64 GB
Package Type	Package Style	BGA
Form Factor	Ball Grid Array (BGA)	169-Ball
Ball Pitch	Distance Between Balls	0.8 mm
Operating Voltage	Supply Voltage (Vcc)	1.8 V 卤 0.1 V
Interface	Data Interface	Toggle Mode 2.0
Data Rate	Maximum Data Transfer Rate	400 MB/s
Operating Temperature	Temperature Range for Normal Operation	-40掳C to +85掳C
Storage Temperature	Temperature Range for Storage	-55掳C to +125掳C
Endurance	Program/Erase Cycles	Up to 3,000
Retention	Data Retention Time	10 years at 25掳C
ECC Requirement	Error Correction Code Requirement	Up to 24 bits/512 B

Instructions for Use

1. Power Supply:

   • Ensure that the supply voltage (Vcc) is within the specified range of 1.8 V 卤 0.1 V.
   • Use a stable power supply to avoid voltage fluctuations that could damage the device.

2. Interface Configuration:

   • Connect the device using the Toggle Mode 2.0 interface for optimal performance.
   • Ensure that the data lines are properly terminated to minimize signal reflections and improve data integrity.

3. Temperature Management:

   • Operate the device within the temperature range of -40掳C to +85掳C for normal operation.
   • Store the device within the temperature range of -55掳C to +125掳C to ensure long-term reliability.

4. Programming and Erasing:

   • The device supports up to 3,000 program/erase cycles. Avoid excessive cycling to extend the lifespan of the memory.
   • Use appropriate error correction code (ECC) algorithms to correct bit errors and maintain data integrity. The device requires up to 24 bits of ECC per 512 bytes of data.

5. Data Retention:

   • The device retains data for up to 10 years at 25掳C. For longer storage periods or higher temperatures, consider periodic refresh operations to maintain data integrity.

6. Handling and Storage:

   • Handle the device with care to avoid physical damage.
   • Store the device in a dry, cool environment to prevent moisture damage.

7. Soldering:

   • Follow recommended soldering profiles to avoid thermal stress that could damage the device.
   • Use a reflow oven with a controlled temperature profile to ensure uniform heating and cooling.

8. Testing:

   • Perform initial testing to verify the functionality of the device.
   • Regularly test the device during operation to ensure continued performance and reliability.

(For reference only)