SII8784CNUC
Specifications
SKU
11728757
Details
BUY SII8784CNUC https://www.utsource.net/itm/p/11728757.html
| Parameter | Description | Min | Typ | Max | Unit |
|---|---|---|---|---|---|
| Supply Voltage (VDD) | Operating supply voltage | 2.7 | - | 5.5 | V |
| Operating Temperature | Range for normal operation | -40 | - | 85 | 掳C |
| Storage Temperature | Range for storage | -65 | - | 150 | 掳C |
| Input Voltage (VIN) | Range for input power | 3.0 | - | 5.5 | V |
| Output Current (IOUT) | Maximum output current | - | 1.5 | - | A |
| Standby Current (ISTBY) | Current consumption in standby mode | - | 10 | - | 渭A |
| Data Rate | Maximum data rate supported | - | 10 | - | Gbps |
| ESD Rating | Human Body Model (HBM) | - | - | 4000 | V |
| Package Type | Physical package | QFN-32 | - | - | - |
| Pin Count | Number of pins | - | 32 | - | - |
Instructions for SII8784CNUC
Power Supply:
- Ensure that the supply voltage (VDD) is within the range of 2.7V to 5.5V.
- Use a stable power source to avoid voltage fluctuations.
Temperature Considerations:
- Operate the device within the temperature range of -40掳C to 85掳C for optimal performance.
- Store the device between -65掳C and 150掳C to prevent damage.
Input Power:
- The input voltage (VIN) should be within the range of 3.0V to 5.5V.
- Use appropriate voltage regulators if necessary to maintain the required input voltage.
Output Current:
- The maximum output current (IOUT) is 1.5A. Ensure that the load does not exceed this limit to avoid damage.
Standby Mode:
- In standby mode, the current consumption (ISTBY) is approximately 10渭A. Use this mode to conserve power when the device is not in active use.
Data Rate:
- The device supports a maximum data rate of 10Gbps. Ensure that the system design can handle this data rate for optimal performance.
ESD Protection:
- The device has an ESD rating of 4000V (Human Body Model). Handle the device with care to avoid electrostatic discharge.
Package and Handling:
- The device is packaged in a QFN-32 package with 32 pins. Follow proper handling procedures to avoid physical damage to the package and pins.
Schematic and Layout:
- Refer to the datasheet for detailed schematic diagrams and PCB layout recommendations to ensure reliable operation.
Testing and Validation:
- Perform thorough testing and validation of the device in your application to ensure it meets all performance requirements.
For more detailed information, refer to the datasheet and application notes provided by the manufacturer.
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