Details

---

BUY XCV2000E-6BG560C https://www.utsource.net/itm/p/11728852.html

Parameter	Description
Device Type	FPGA (Field-Programmable Gate Array)
Family	Virtex-E
Device	XCV2000E
Speed Grade	-6
Package	BG560C (BGA 560 Pin)
Configuration Memory	1.5 Mb (1,536,000 bits)
Logic Cells	2,000 CLBs (Configurable Logic Blocks)
I/O Pins	372
Maximum Frequency	300 MHz (for -6 speed grade)
Operating Voltage	1.8V core, 3.3V I/O
Configuration Mode	Boundary Scan, JTAG, Master/Slave Serial, SelectMAP, and Slave Parallel
Temperature Range	Commercial: 0掳C to 70掳C, Industrial: -40掳C to 85掳C
Power Consumption	Typical: 1.5W (static), 10W (dynamic)
Packaging	Tape and Reel

Instructions for Handling and Use:

1. Handling Precautions:

   • ESD Protection: Handle the device with ESD (Electrostatic Discharge) protection measures, such as using an ESD wrist strap.
   • Avoid Physical Damage: Be cautious to avoid dropping or applying excessive force to the device, especially the BGA pins.

2. Storage:

   • Store the device in a dry, cool place to prevent moisture damage.
   • Use anti-static bags or containers for long-term storage.

3. Mounting:

   • Soldering: Follow recommended soldering profiles to ensure proper bonding without overheating the device.
   • Alignment: Ensure the device is correctly aligned on the PCB before soldering to avoid misalignment issues.

4. Configuration:

   • Configuration Modes: Choose the appropriate configuration mode based on your application requirements (Boundary Scan, JTAG, Master/Slave Serial, SelectMAP, or Slave Parallel).
   • Configuration Files: Use Xilinx design tools to generate the necessary configuration files and bitstreams.

5. Power Supply:

   • Core Voltage: Ensure the core voltage is set to 1.8V.
   • I/O Voltage: Set the I/O voltage to 3.3V unless otherwise specified.
   • Decoupling Capacitors: Place decoupling capacitors close to the power supply pins to minimize noise and improve stability.

6. Testing:

   • Functional Testing: Perform functional testing to verify that the device operates as expected.
   • Boundary Scan Testing: Utilize boundary scan testing to check for manufacturing defects and ensure proper connectivity.

7. Documentation:

   • Refer to the Xilinx Virtex-E User Guide and Data Sheet for detailed technical specifications and additional information.

By following these instructions, you can ensure the proper handling, mounting, and operation of the XCV2000E-6BG560C FPGA.

(For reference only)