Details

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BUY H26M52103FMRAR https://www.utsource.net/itm/p/11731970.html

Parameter	Symbol	Min	Typ	Max	Unit	Description
Operating Voltage	VCC	1.7	-	3.6	V	Supply voltage range
Standby Current	ISB	-	1	2	μA	Current consumption in standby mode
Active Current	IOP	5	-	20	mA	Maximum current consumption in active mode
Output Voltage Range	VOUT	0.4	-	3.6	V	Range of output voltages
Output Current	IOUT	-	50	100	mA	Maximum continuous output current
Output Ripple Voltage	VRIP	-	30	50	mVpp	Peak-to-peak ripple voltage at full load
Load Regulation	ΔVOL	-	0.5	1	%	Change in output voltage with load
Line Regulation	ΔVOL	-	0.1	0.5	%	Change in output voltage with input voltage
Thermal Shutdown	TSD	-	150	170	°C	Temperature at which the device will shut down to prevent damage
Operating Temperature	TOPR	-40	-	85	°C	Temperature range for normal operation
Storage Temperature	TSTG	-65	-	150	°C	Temperature range for storage
Package Type	-	-	-	-	QFN-16	Package type
Pin Count	-	-	-	-	16	Number of pins

Instructions for Use:

1. Power Supply:

   • Ensure the supply voltage (VCC) is within the specified range of 1.7V to 3.6V.
   • Connect a bypass capacitor (typically 10μF) between VCC and GND close to the device to filter out noise.

2. Output Configuration:

   • The output voltage (VOUT) can be set using external resistors or by selecting a fixed output voltage version of the device.
   • Ensure the output load does not exceed the maximum output current (IOUT) of 100mA.

3. Thermal Management:

   • Monitor the operating temperature to ensure it does not exceed 85°C for reliable operation.
   • If the device temperature reaches the thermal shutdown threshold (150°C), the device will automatically shut down to prevent damage.

4. PCB Layout:

   • Place the device on a PCB with adequate heat dissipation, such as a ground plane or heat sink, if necessary.
   • Keep signal traces short and direct to minimize noise and improve performance.

5. Standby Mode:

   • To enter standby mode, set the enable pin (EN) low. The device will consume minimal current (ISB) in this mode.
   • To resume operation, set the enable pin high.

6. Storage:

   • Store the device in a dry environment with temperatures between -65°C and 150°C to maintain its integrity.

7. Handling:

   • Handle the device with care to avoid static discharge, which can damage the internal circuits.
   • Follow ESD (Electrostatic Discharge) precautions during handling and assembly.

8. Testing:

   • Before finalizing the design, test the device under various operating conditions to ensure it meets the required specifications and performance criteria.

(For reference only)