LM5112MY/NOPB
Category: Elec-component74 series Digital Integrated Circuits74 series Digital Integrated CircuitsIntegrated Circuit
Specifications
SKU
11741559
Details
BUY LM5112MY/NOPB https://www.utsource.net/itm/p/11741559.html
| Parameter | Symbol | Min | Typical | Max | Unit | Conditions |
|---|---|---|---|---|---|---|
| Input Voltage Range | VIN | 4.5 | - | 60 | V | Continuous operation |
| Output Current | IOUT | - | 2.0 | 3.0 | A | Continuous, at 25掳C ambient |
| Switching Frequency | fSW | 200 | 700 | 2000 | kHz | Adjustable |
| Efficiency (Typical) | 畏 | - | 96 | - | % | At 12V input, 5V output, 1A load |
| Quiescent Current | IQ | - | 180 | - | 渭A | No load, 12V input |
| Shutdown Current | ISD | - | 1 | - | 渭A | VEN = 0V |
| Thermal Shutdown Temperature | TSD | - | 160 | - | 掳C | Typical |
| Operating Junction Temperature | TJ | -40 | - | 125 | 掳C | Storage and operation |
| Package | - | - | - | - | - | SOIC-8 |
Instructions for Use:
Input Voltage (VIN):
- Ensure the input voltage is within the specified range of 4.5V to 60V.
- Use appropriate input filtering and decoupling capacitors to stabilize the input voltage.
Output Configuration:
- Set the output voltage using external resistors connected to the FB pin.
- Use an inductor and output capacitor to filter the switching waveform and provide a stable output.
Switching Frequency (fSW):
- Adjust the switching frequency by connecting an external resistor to the RT pin.
- Higher frequencies reduce the size of external components but may increase power loss.
Thermal Management:
- Ensure adequate heat dissipation to keep the junction temperature below 125掳C.
- Use a heatsink if necessary, especially under high load conditions.
Enable Pin (VEN):
- The device can be enabled or disabled by applying a logic high or low to the VEN pin.
- When VEN is low, the device enters a low-power shutdown mode with minimal current draw.
Protection Features:
- The LM5112MY/NOPB includes overcurrent protection, thermal shutdown, and undervoltage lockout (UVLO) to protect against various fault conditions.
- Ensure these features are properly configured to avoid damage to the device.
Layout Considerations:
- Follow good PCB layout practices to minimize noise and parasitic effects.
- Keep high-current paths short and wide, and use ground planes to reduce inductance.
Storage and Handling:
- Store the device in a dry, cool environment.
- Handle with care to avoid static discharge, which can damage the device.
By following these instructions, you can ensure reliable and efficient operation of the LM5112MY/NOPB in your application.
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