Details

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Parameter Description Value Units
Part Number Full part number HMC284AMS8GETR -
Function High-performance GaAs pHEMT MMIC SP6T switch - -
Frequency Range Operating frequency range 50 MHz to 18 GHz -
Insertion Loss Maximum insertion loss at 18 GHz 0.7 dB
Isolation Minimum isolation between ports 30 dB
Input Power (P1dB) 1 dB compression point +29 dBm
Input VSWR Voltage Standing Wave Ratio at input 1.8:1 -
Output VSWR Voltage Standing Wave Ratio at output 1.8:1 -
Control Voltage Control voltage for switching 0 V, +5 V V
Supply Voltage Operating supply voltage +5 V V
Quiescent Current Quiescent current 30 mA
Operating Temperature Temperature range for operation -40 to +85 掳C
Storage Temperature Temperature range for storage -55 to +125 掳C
Package Type Surface mount package 8-lead LLP -
Dimensions Package dimensions 3 x 3 x 0.75 mm

Instructions

  1. Power Supply:

    • Connect the +5 V supply to the Vdd pin.
    • Ensure the power supply is stable and within the specified range.
  2. Control Signals:

    • Apply 0 V or +5 V to the control pins (A1, A2, A3) to select the desired switch state.
    • Refer to the truth table for specific switch configurations.
  3. Signal Path:

    • Connect the RF signals to the appropriate input and output ports.
    • Ensure the VSWR requirements are met to avoid signal degradation.
  4. Thermal Management:

    • Mount the device on a suitable heat sink or thermal pad to manage heat dissipation.
    • Ensure proper ventilation if operating at high temperatures.
  5. Handling:

    • Handle the device with care to avoid damage to the leads and package.
    • Use anti-static precautions to prevent ESD damage.
  6. Testing:

    • Test the device using a network analyzer or similar equipment to verify performance parameters.
    • Check insertion loss, isolation, and VSWR at key frequencies within the operating range.
  7. Storage:

    • Store the device in a dry, cool place within the specified temperature range.
    • Avoid exposure to high humidity and corrosive environments.
  8. Soldering:

    • Follow recommended soldering profiles to ensure reliable connections.
    • Avoid excessive heat and mechanical stress during soldering.
(For reference only)

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