Details

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BUY STB80NF55-08T4 https://www.utsource.net/itm/p/11741694.html

Parameter	Symbol	Min	Typ	Max	Unit	Condition
Drain-Source Voltage	VDS	-	55	-	V
Gate-Source Voltage	VGS	-15	-	15	V
Continuous Drain Current	ID	-	80	-	A	TC = 25掳C
Pulse Drain Current	ID(peak)	-	160	-	A	TC = 25掳C, tp = 10 渭s, fc = 1 kHz
Power Dissipation	PD	-	-	175	W	TC = 25掳C
Junction Temperature	TJ	-	-	175	掳C
Storage Temperature Range	TSTG	-55	-	150	掳C
Thermal Resistance, Junction to Case	R胃JC	-	0.35	-	掳C/W

Instructions for Use:

1. Handling Precautions:

   • ESD Protection: The device is sensitive to electrostatic discharge (ESD). Use proper ESD protection measures during handling and installation.
   • Soldering Temperature: Ensure that the soldering temperature does not exceed 260掳C for more than 10 seconds.

2. Operating Conditions:

   • Drain-Source Voltage (V_DS): Ensure that the drain-source voltage does not exceed 55V to prevent damage to the device.
   • Gate-Source Voltage (V_GS): The gate-source voltage should be kept within the range of -15V to +15V to avoid gate oxide breakdown.
   • Continuous Drain Current (I_D): The continuous drain current should not exceed 80A at a case temperature of 25掳C. For higher temperatures, derate the current according to the thermal resistance and power dissipation specifications.
   • Pulse Drain Current (I_D(peak)): The pulse drain current can reach up to 160A under the specified conditions (t_p = 10 渭s, f_c = 1 kHz).

3. Thermal Management:

   • Power Dissipation (P_D): The maximum power dissipation is 175W at a case temperature of 25掳C. Proper heat sinking is required to manage the junction temperature.
   • Junction Temperature (T_J): The junction temperature should not exceed 175掳C. Use appropriate cooling methods such as heatsinks or forced air cooling to maintain the junction temperature within safe limits.
   • Thermal Resistance (R_胃JC): The thermal resistance from the junction to the case is 0.35掳C/W. This value is crucial for calculating the required heat sink size.

4. Storage and Transportation:

   • Storage Temperature (T_STG): Store the device in a dry environment with a temperature range of -55掳C to 150掳C.
   • Humidity: Protect the device from high humidity to prevent moisture-related issues.

5. Mounting and Assembly:

   • Mounting Torque: Apply the recommended mounting torque to the screws to ensure good thermal contact between the device and the heat sink.
   • Alignment: Ensure proper alignment of the device on the PCB to avoid mechanical stress and potential damage.

For detailed application notes and further information, refer to the datasheet provided by STMicroelectronics.

(For reference only)