Details

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BUY MB89254 https://www.utsource.net/itm/p/11750048.html

Parameter	Symbol	Conditions	Min	Typ	Max	Unit
Supply Voltage	Vcc	Operating	2.7	5.0	5.5	V
Operating Temperature	Topr	-	-40		85	°C
Storage Temperature	Tstg	-	-65		150	°C
Input Voltage Range	Vin	-	0		Vcc	V
Output Voltage Range	Vout	-	0		Vcc	V
Maximum Output Current	Iout	Continuous		50	100	mA
Quiescent Current	Iq	No Load	1	3	5	μA
Standby Current	Isb	Shutdown Mode	0.1	0.5	1	μA
Dropout Voltage	Vdo	Iout = 100mA		1.2	1.5	V
Load Regulation	ΔVout/ΔIout	Iout = 0 to 100mA		0.1	0.5	%
Line Regulation	ΔVout/ΔVin	Vin = 2.7 to 5.5V		0.1	0.5	%
Ripple Rejection	RR	1kHz	60	70	80	dB
Thermal Resistance (θJA)	θJA	Free Air		120	150	°C/W

Instructions for Use:

1. Power Supply:

   • Ensure the supply voltage (Vcc) is within the specified range of 2.7V to 5.5V.
   • Use appropriate decoupling capacitors (typically 10μF and 0.1μF) close to the Vcc pin to stabilize the power supply.

2. Input and Output Capacitors:

   • Connect a 10μF electrolytic capacitor between the input (Vin) and ground.
   • Connect a 0.1μF ceramic capacitor between the output (Vout) and ground to improve transient response and stability.

3. Thermal Management:

   • If operating at high current or in high ambient temperatures, ensure adequate heat dissipation by using a heatsink or ensuring good airflow around the device.
   • Monitor the junction temperature to stay below the maximum storage temperature of 150°C.

4. Shutdown Mode:

   • To enter shutdown mode, pull the enable (EN) pin low. The quiescent current will drop to the standby current level.
   • To resume operation, pull the EN pin high.

5. Output Current:

   • Do not exceed the maximum continuous output current of 100mA to avoid overheating and potential damage to the device.
   • For higher current requirements, consider using an external transistor or a more powerful regulator.

6. Ripple Rejection:

   • The device provides good ripple rejection, but for optimal performance, use low-ESR capacitors and keep the PCB layout compact to minimize parasitic inductance.

7. Storage and Handling:

   • Store the device in a dry, cool place away from direct sunlight.
   • Handle with care to avoid static discharge, which can damage the device.

8. Mounting:

   • Follow standard surface mount technology (SMT) procedures for mounting the device on the PCB.
   • Ensure proper soldering to avoid cold solder joints and ensure reliable electrical connections.

(For reference only)