Details

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BUY 2SC3263 TO-247 ORIGINAL GOODS IN STOCK https://www.utsource.net/itm/p/11758689.html

Parameter	Description	Value
Part Number	Component Identifier	2SC3263
Package Type	Physical Package	TO-247
Type	Transistor Type	NPN Silicon Power Transistor
Collector-Emitter Voltage (Vceo)	Maximum Collector-Emitter Voltage	800 V
Collector-Base Voltage (Vcbo)	Maximum Collector-Base Voltage	800 V
Emitter-Base Voltage (Vebo)	Maximum Emitter-Base Voltage	5 V
Collector Current (Ic)	Continuous Collector Current	15 A
Power Dissipation (Ptot)	Total Power Dissipation	150 W
Operating Temperature Range (Tj)	Junction Temperature Range	-55掳C to +150掳C
Storage Temperature Range (Tstg)	Storage Temperature Range	-55掳C to +150掳C
hFE (DC Current Gain)	DC Current Gain	10 to 100 (at Ic = 1 A, Vce = 10 V)
Transition Frequency (ft)	Transition Frequency	1 MHz
Saturation Voltage (Vce(sat))	Collector-Emitter Saturation Voltage	1.8 V (at Ic = 15 A, Ib = 1.5 A)
Storage and Handling	Recommended Storage Conditions	Dry and Cool Environment
RoHS Compliance	Compliance with RoHS Directives	Yes
Lead Finish	Surface Finish of Leads	Tin-Plated

Instructions for Use:

1. Mounting and Handling:

   • Ensure that the mounting surface is clean and flat.
   • Use appropriate heat sink compound to improve thermal conductivity.
   • Avoid excessive mechanical stress on the leads during soldering and handling.

2. Soldering:

   • Preheat the component to reduce thermal shock.
   • Use a temperature-controlled soldering iron and avoid overheating.
   • Soldering time should not exceed 3 seconds per joint.
   • Allow the component to cool naturally after soldering.

3. Electrical Connections:

   • Connect the collector, base, and emitter terminals correctly.
   • Ensure that the maximum ratings are not exceeded during operation.
   • Use bypass capacitors to filter out noise and stabilize the circuit.

4. Thermal Management:

   • Ensure adequate cooling, especially when operating at high power levels.
   • Use a heatsink with sufficient thermal capacity and proper thermal interface materials.
   • Monitor the junction temperature to prevent overheating.

5. Storage:

   • Store in a dry and cool environment to prevent corrosion and degradation.
   • Keep the components in their original packaging until ready for use.

6. Testing:

   • Perform initial testing under controlled conditions to verify performance.
   • Use appropriate test equipment and follow safety guidelines.

7. Disposal:

   • Dispose of the component according to local regulations and environmental guidelines.
   • Recycle if possible.

(For reference only)