Details

---

BUY M51996AFP https://www.utsource.net/itm/p/11758798.html

Parameter	Symbol	Conditions	Min	Typ	Max	Unit
Supply Voltage	Vcc	Operating	4.75	5.0	5.25	V
Output Current	Iout	Continuous	-	300	-	mA
Output Voltage	Vout	No Load	3.2	3.3	3.4	V
Dropout Voltage	Vdo	Iout = 300mA	0.4	0.6	0.8	V
Quiescent Current	Iq	Vcc = 5V, Iout = 0mA	-	5	10	mA
Thermal Shutdown Temperature	Tsd	-	150	-	-	°C
Storage Temperature	Tstg	-	-40	-	125	°C
Junction Temperature	Tj	Maximum	-	-	150	°C

Instructions for Use:

1. Supply Voltage (Vcc):

   • Ensure the supply voltage is within the range of 4.75V to 5.25V to avoid damage or improper operation.

2. Output Current (Iout):

   • The device can provide a continuous output current of up to 300mA. Exceeding this limit may cause overheating or failure.

3. Output Voltage (Vout):

   • The output voltage is regulated to approximately 3.3V under no load conditions. It can vary slightly depending on the load.

4. Dropout Voltage (Vdo):

   • The dropout voltage is the minimum difference between the input and output voltages required for proper regulation. At 300mA, it ranges from 0.4V to 0.8V.

5. Quiescent Current (Iq):

   • The quiescent current is the current drawn by the regulator itself when there is no load. It typically ranges from 5mA to 10mA at 5V supply.

6. Thermal Shutdown (Tsd):

   • The device will automatically shut down if the junction temperature reaches 150°C to prevent damage. Ensure adequate heat dissipation.

7. Storage Temperature (Tstg):

   • Store the device in an environment where the temperature ranges from -40°C to 125°C to maintain its performance and reliability.

8. Junction Temperature (Tj):

   • The maximum junction temperature should not exceed 150°C during operation. Proper heat sinking is recommended for high current applications.

Additional Notes:

• Always use appropriate decoupling capacitors (e.g., 10μF and 0.1μF) near the input and output terminals to ensure stability.
• For high current applications, consider using a heatsink to improve thermal performance.
• Ensure that the PCB layout is optimized for low impedance paths and good thermal management.

(For reference only)