Details

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BUY 10M02SCU169C8G https://www.utsource.net/itm/p/11759959.html

Parameter	Description	Value
Device		10M02SCU169C8G
Family	FPGA Family	Cyclone 10 LP
Package	Package Type	UFBGA (169)
I/O Banks	Number of I/O Banks	4
I/O Pins	Total I/O Pins	132
Configuration Memory	Configuration Memory Size	2.5 Mb
Logic Elements (LEs)	Number of Logic Elements	10,240
ALMs	Adaptive Logic Modules	6,400
DSP Blocks	Number of DSP Blocks	120
RAM Blocks	Number of RAM Blocks	288
Max User Flash Memory	User Flash Memory Size	512 Kb
Max Oscillator Frequency	Internal Oscillator Frequency Range	0 - 100 MHz
Operating Temperature	Operating Temperature Range	-40掳C to +100掳C
Supply Voltage	Core Supply Voltage	1.2 V
I/O Supply Voltage	I/O Supply Voltage	1.2 V, 1.5 V, 1.8 V, 2.5 V, 3.3 V
Configuration Modes	Supported Configuration Modes	Active Serial, Passive Serial, JTAG, AS, PS, etc.
Programming Interface	Programming Interface	JTAG, AS, PS
Power Consumption	Typical Power Consumption (Static)	10 mW (at 1.2 V)
Package Pitch	Ball Pitch	0.8 mm
Package Body Size	Package Body Size	10 mm x 10 mm

Instructions for Use

1. Power Supply Requirements:

   • Ensure that the core supply voltage (VCCINT) is set to 1.2 V.
   • The I/O supply voltages (VCCIO) can be set to 1.2 V, 1.5 V, 1.8 V, 2.5 V, or 3.3 V depending on the I/O standard used.

2. Configuration:

   • Use the JTAG interface for programming and debugging.
   • For stand-alone operation, configure the device using the Active Serial (AS) or Passive Serial (PS) modes.
   • Ensure the configuration file is correctly formatted and compatible with the device.

3. Thermal Management:

   • Place the device in an area with adequate airflow to ensure proper cooling.
   • Consider using a heat sink if the device is expected to operate at high temperatures or under heavy load.

4. Signal Integrity:

   • Use controlled impedance traces for high-speed signals to minimize signal degradation.
   • Terminate differential pairs appropriately to reduce reflections and crosstalk.

5. Handling:

   • Handle the device with care to avoid damage from electrostatic discharge (ESD).
   • Use ESD-safe equipment and practices when handling the device.

6. Storage:

   • Store the device in a dry, cool place to prevent moisture damage.
   • Keep the device in its original packaging until ready for use.

7. Testing:

   • Perform functional tests after programming to ensure the device is operating correctly.
   • Use boundary scan testing via JTAG to verify the integrity of the device and connections.

8. Documentation:

   • Refer to the device datasheet and user manual for detailed information on specific features and usage guidelines.
   • Consult the Intel FPGA documentation for additional resources and support.

(For reference only)