SGT40N60NPFDPN TO-3P IGBT ORIGINAL STOCK
Category: TransistorsBipolar transistors
Specifications
SKU
11772557
Details
BUY SGT40N60NPFDPN TO-3P IGBT ORIGINAL STOCK https://www.utsource.net/itm/p/11772557.html
| Parameter | Value/Description |
|---|---|
| Part Number | SGT40N60NPFDPN |
| Package Type | TO-3P |
| Component Type | IGBT (Insulated Gate Bipolar Transistor) |
| Brand | Original Stock |
| Maximum Collector-Emitter Voltage (Vce) | 600 V |
| Maximum Collector Current (Ic) | 40 A |
| Maximum Gate-Emitter Voltage (Vge) | 卤20 V |
| Continuous Collector Current (Ic) at Tc = 25掳C | 40 A |
| Continuous Collector Current (Ic) at Tc = 100掳C | 32 A |
| Pulse Collector Current (Icm) | 120 A |
| Power Dissipation (Ptot) at Tc = 25掳C | 180 W |
| Power Dissipation (Ptot) at Tc = 100掳C | 144 W |
| Thermal Resistance, Junction to Case (Rth(j-c)) | 0.75 K/W |
| Storage Temperature Range (Tstg) | -55掳C to +150掳C |
| Operating Temperature Range (Tj) | -55掳C to +150掳C |
| Case Color | Black |
| Lead Finish | Matte Tin |
| RoHS Compliant | Yes |
Instructions for Use:
Handling Precautions:
- Handle with care to avoid damage to the leads and case.
- Avoid exposing the device to excessive static electricity.
Mounting:
- Ensure proper heat sinking to maintain the junction temperature within the specified range.
- Use a thermal compound between the IGBT and the heatsink for better thermal conductivity.
Soldering:
- Preheat the device to 125掳C before soldering.
- Soldering temperature should not exceed 260掳C.
- Soldering time should be kept to a minimum (less than 10 seconds).
Electrical Connections:
- Connect the collector (C), gate (G), and emitter (E) terminals correctly.
- Ensure that the gate-emitter voltage (Vge) does not exceed the maximum rating.
- Use appropriate gate drive circuits to ensure reliable operation.
Storage:
- Store in a dry, cool place away from direct sunlight and corrosive environments.
- Keep the devices in their original packaging until ready for use.
Testing:
- Use a multimeter or an IGBT tester to verify the functionality of the device.
- Test the device under controlled conditions to avoid damage.
Disposal:
- Dispose of the device according to local environmental regulations.
For more detailed information, refer to the datasheet provided by the manufacturer.
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