Details

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BUY STTH1002CBY-TR https://www.utsource.net/itm/p/11772946.html

Parameter	Symbol	Min	Typ	Max	Unit
Forward Voltage	VF	-	1.2	1.6	V
Reverse Breakdown Voltage	VBR	50	-	-	V
Forward Current (Continuous)	IF	-	100	-	mA
Peak Forward Current	IF(surge)	-	1000	-	mA
Reverse Current	IR	-	100	-	nA
Operating Temperature	TOP	-40	-	125	掳C
Storage Temperature	TSTG	-55	-	150	掳C
Thermal Resistance (Junction to Ambient)	R胃JA	-	200	-	K/W

Instructions for Use

1. Mounting:

   • Ensure that the device is mounted on a suitable PCB with proper thermal management.
   • Use appropriate soldering techniques to avoid thermal shock.

2. Electrical Connections:

   • Connect the forward voltage (V_F) and forward current (I_F) within the specified limits.
   • Ensure that the reverse voltage (V_BR) does not exceed the maximum rating.

3. Thermal Management:

   • Keep the operating temperature (T_OP) within the specified range to ensure reliable operation.
   • If necessary, use heat sinks or other cooling methods to manage thermal resistance (R_胃JA).

4. Storage:

   • Store the device in a dry, cool place within the storage temperature range (T_STG).
   • Avoid exposure to extreme temperatures and humidity.

5. Handling:

   • Handle the device with care to avoid mechanical damage.
   • Follow ESD (Electrostatic Discharge) precautions to prevent damage from static electricity.

6. Surge Current:

   • The device can handle peak forward current (I_F(surge)) for short durations. Ensure that these surges are within the specified limits and do not occur frequently.

7. Reverse Current:

   • The reverse current (I_R) should be kept as low as possible to minimize leakage and potential damage.

8. Testing:

   • Before final assembly, test the device under controlled conditions to ensure it meets the required specifications.

9. Compliance:

   • Ensure that the device complies with all relevant safety and regulatory standards for your application.

(For reference only)