TPS65910A31A1RSLR
Category: Elec-component74 series Digital Integrated Circuits74 series Digital Integrated CircuitsIntegrated Circuit
Specifications
SKU
11773016
Details
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| Parameter | Symbol | Min | Typ | Max | Unit | Description |
|---|---|---|---|---|---|---|
| Input Voltage | VIN | 2.7 | - | 5.5 | V | Operating input voltage range |
| Output Voltage Range | VOUT | 0.8 | - | 3.3 | V | Adjustable output voltage range |
| Quiescent Current | IQ | - | 10 | - | 渭A | Typical quiescent current |
| Load Current | ILOAD | - | 500 | - | mA | Maximum continuous load current |
| Efficiency (Typical) | 畏 | - | 90 | - | % | Efficiency at typical conditions |
| Shutdown Current | ISD | - | 0.1 | - | 渭A | Shutdown mode current |
| Operating Temperature Range | TOPR | -40 | - | 85 | 掳C | Operating temperature range |
| Storage Temperature Range | TSTG | -40 | - | 125 | 掳C | Storage temperature range |
| Junction Temperature | TJ | - | - | 125 | 掳C | Maximum junction temperature |
| Package Type | PKG | - | - | - | - | TSSOP-20 |
Instructions for Use
Power Supply Connection:
- Connect the input voltage (VIN) to the power supply within the specified range (2.7V to 5.5V).
- Ensure proper decoupling capacitors are placed close to the input and output pins to maintain stability.
Output Configuration:
- Set the desired output voltage using external resistors connected to the feedback (FB) pin.
- Refer to the datasheet for the specific resistor values required to achieve the desired output voltage.
Enable/Shutdown Control:
- The enable (EN) pin can be used to turn the device on or off. Apply a high signal to enable the device and a low signal to shut it down.
- In shutdown mode, the device consumes minimal current (ISD).
Thermal Management:
- Ensure adequate heat dissipation by providing a good thermal path from the package to the PCB.
- Avoid operating the device beyond its maximum junction temperature (TJ).
Layout Considerations:
- Place the input and output capacitors as close as possible to the respective pins to minimize parasitic inductance.
- Use wide traces for power and ground connections to reduce resistance and improve thermal performance.
Protection Features:
- The device includes overcurrent protection (OCP), overvoltage protection (OVP), and thermal shutdown (TSD) to prevent damage under fault conditions.
- Ensure that the load does not exceed the maximum load current (ILOAD) to avoid triggering protection features.
Storage and Handling:
- Store the device in a dry environment within the specified storage temperature range.
- Handle with care to avoid static discharge, which can damage the device.
For more detailed information, refer to the TPS65910A31A1RSLR datasheet provided by Texas Instruments.
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