Details

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BUY UCC27524DGNR https://www.utsource.net/itm/p/11773264.html

Parameter	Symbol	Min	Typical	Max	Unit	Condition
Supply Voltage	VDD	4.5	-	18	V	-
Gate-Source Voltage	VGS	-18	-	18	V	-
Output Source Current	IOH	-	4.5	-	A	VDD = 12V, RL = 3.3惟
Output Sink Current	IOL	-	6.0	-	A	VDD = 12V, RL = 3.3惟
Propagation Delay (High-to-Low)	tdL	-	25	-	ns	VDD = 12V, CL = 1000pF
Propagation Delay (Low-to-High)	tdH	-	20	-	ns	VDD = 12V, CL = 1000pF
Rise Time	tr	-	9	-	ns	VDD = 12V, CL = 1000pF
Fall Time	tf	-	7	-	ns	VDD = 12V, CL = 1000pF
Quiescent Current	IQ	-	2.5	-	渭A	VDD = 12V, No Load
Operating Temperature Range	TOP	-40	-	125	掳C	-

Instructions for Use:

1. Power Supply:

   • Ensure the supply voltage (V_DD) is within the range of 4.5V to 18V.
   • Connect the V_DD pin to the power supply and the GND pin to ground.

2. Gate Drive:

   • The UCC27524DGNR can drive both N-channel and P-channel MOSFETs.
   • Connect the IN pin to your control signal.
   • Connect the OUT pin to the gate of the MOSFET being driven.
   • Ensure the gate-source voltage (V_GS) does not exceed 卤18V.

3. Output Current:

   • The device can source up to 4.5A and sink up to 6.0A.
   • Ensure the load resistance (R_L) is appropriate to avoid exceeding these limits.

4. Timing Parameters:

   • The propagation delays (t_dL and t_dH) and rise/fall times (t_r and t_f) are optimized for high-speed switching applications.
   • Use these parameters to design your timing circuits and ensure proper operation.

5. Thermal Management:

   • The operating temperature range is from -40掳C to 125掳C.
   • Ensure adequate heat dissipation if operating at higher temperatures or under high current conditions.

6. Quiescent Current:

   • The quiescent current (I_Q) is typically 2.5渭A, which is very low, making the device suitable for battery-powered applications.

7. Storage and Handling:

   • Store the device in a dry environment and handle with care to avoid damage from electrostatic discharge (ESD).

8. Schematic and Layout:

   • Follow recommended PCB layout guidelines to minimize parasitic inductances and ensure stable operation.
   • Place decoupling capacitors close to the V_DD and GND pins to filter out noise.

For detailed application notes and further information, refer to the datasheet provided by Texas Instruments.

(For reference only)