Details

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BUY HY1908B TO-263 80V90A REPLACEABLE IRF2807ZS HUF75545S3S https://www.utsource.net/itm/p/11773353.html
domestic

Parameter	Value
Part Number	HY1908B
Package Type	TO-263 (D2PAK)
Maximum Drain Voltage	80V
Continuous Drain Current	90A (at Tc = 25掳C)
Pulse Drain Current	180A (t = 10ms, Tc = 25掳C)
Gate-Source Voltage	卤20V
Rds(on) @ Vgs = 10V	4.5m惟 (max)
Input Capacitance	2200pF (typ)
Output Capacitance	1400pF (typ)
Gate Charge	135nC (typ)
Operating Temperature Range	-55掳C to +150掳C
Storage Temperature Range	-65掳C to +150掳C
Thermal Resistance (RthJC)	0.35掳C/W (max)
Thermal Resistance (RthCS)	0.75掳C/W (max)

Instructions for Use:

1. Mounting:

   • Ensure that the TO-263 package is securely mounted to a heatsink to manage thermal dissipation.
   • Use thermal paste or a thermal pad between the device and the heatsink to improve heat transfer.

2. Electrical Connections:

   • Connect the drain (D), source (S), and gate (G) terminals correctly.
   • Use short, thick wires to minimize inductance and resistance in the connections.
   • Ensure that the gate drive circuit can provide sufficient current to charge and discharge the gate capacitance quickly.

3. Operating Conditions:

   • Do not exceed the maximum ratings for voltage, current, and temperature.
   • Keep the junction temperature within the specified range to avoid damage.
   • Use appropriate cooling methods (e.g., forced air, liquid cooling) if operating at high power levels.

4. Storage:

   • Store the device in a dry, cool place away from direct sunlight and corrosive environments.
   • Handle with care to avoid mechanical damage.

5. Handling Precautions:

   • The device is sensitive to electrostatic discharge (ESD). Use ESD protection measures when handling the device.
   • Avoid touching the leads and the body of the device directly with bare hands.

6. Testing:

   • Before installing the device in a circuit, test it using a suitable test setup to ensure it meets the specified parameters.
   • Use a curve tracer or a similar device to verify the Rds(on) and other electrical characteristics.

7. Soldering:

   • Use a controlled soldering process to avoid overheating the device.
   • Follow the recommended soldering profile provided by the manufacturer.

8. Compliance:

   • Ensure that the device complies with all relevant safety and regulatory standards for your application.

(For reference only)