Details
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| Parameter | Symbol | Min | Typ | Max | Unit | Description |
|---|---|---|---|---|---|---|
| Drain-Source On-State Resistance | RDS(on) | - | 0.24 | - | Ω | At VGS = 10V, ID = 5A |
| Breakdown Voltage | V(BR)DSS | 600 | - | - | V | Drain to Source |
| Gate Threshold Voltage | VGS(th) | 2.0 | - | 4.0 | V | Gate to Source |
| Continuous Drain Current | ID | - | 20 | - | A | At Tc = 25°C |
| Power Dissipation | PD | - | 360 | - | W | At TC = 25°C |
| Total Gate Charge | QG | - | 78 | - | nC | At VGS = 10V |
Instructions for FGB20N60:
- Handling Precautions: The FGB20N60 is sensitive to electrostatic discharge (ESD). Use appropriate ESD protection measures during handling and installation.
- Mounting: Ensure the device is mounted on a suitable heatsink if operating at high currents or in high ambient temperatures to maintain junction temperature within safe limits.
- Gate Drive: Apply gate drive voltage between 10V to 20V for optimal performance. Ensure the gate drive circuitry can supply sufficient current to charge and discharge the gate capacitance quickly.
- Storage Conditions: Store in a dry, cool place away from direct sunlight and corrosive materials.
- Operating Temperature: Operate within the specified temperature range to avoid damage or reduced performance. Check the datasheet for exact temperature ranges.
- PCB Layout: Design PCB layout to minimize parasitic inductances, especially for high-frequency switching applications.
- Safety Margin: Design circuits considering a safety margin for parameters like drain-source voltage and current to ensure reliable operation under all conditions.
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