Details
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Parameter | Symbol | Min | Typical | Max | Unit | Condition |
---|---|---|---|---|---|---|
Drain-Source On-Resistance | RDS(on) | - | 12 | - | mΩ | VGS = 10V, ID = 25A |
Gate-Source Threshold Voltage | VGS(th) | 2.0 | - | 4.0 | V | ID = 250μA |
Continuous Drain Current | ID | - | - | 39 | A | TC = 25°C |
Pulse Drain Current | ID pul | - | - | 85 | A | TP = 10ms, TC = 25°C |
Power Dissipation | PD | - | - | 160 | W | TC = 25°C |
Junction Temperature | TJ | - | - | 150 | °C | - |
Storage Temperature Range | TSTG | -55 | - | 150 | °C | - |
Instructions for Use:
- Mounting: Ensure the device is mounted on a suitable heatsink if operating near maximum current or power dissipation limits.
- Gate Drive: Apply gate-source voltage (VGS) within the specified threshold range to ensure proper switching.
- Thermal Management: Monitor junction temperature; do not exceed the maximum specified limit of 150°C.
- Pulse Operation: When using the device in pulse applications, ensure the pulse duration and frequency are within the rated pulse drain current specifications.
- Storage Conditions: Store the device within the temperature range of -55°C to 150°C to avoid damage.
- Electrostatic Sensitivity: Handle with care as the device is sensitive to electrostatic discharge (ESD). Use appropriate ESD protection measures during handling and installation.
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