MC10H211L

MC10H211L

Category: IC Chips

Specifications
Details

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Parameter Symbol Conditions Min Typ Max Unit
Supply Voltage VDD 1.8 5.5 V
Output Current IO Per Output 20 mA
Operating Temperature Toper -40 85 °C
Storage Temperature Tstg -65 150 °C
Input Leakage Current IIH VIN = VDD -1 1 μA
IIL VIN = GND -1 1 μA
Propagation Delay Time tpd VDD = 5V 9 ns
Power Dissipation PD All Outputs High 120 mW

Instructions for MC10H211L:

  1. Power Supply:

    • Ensure the supply voltage (VDD) is within the range of 1.8V to 5.5V.
    • Connect a decoupling capacitor close to the power pins to stabilize the supply voltage.
  2. Operating Environment:

    • Operate the device within the temperature range of -40°C to 85°C for optimal performance.
    • Store the device between -65°C and 150°C.
  3. Input Signals:

    • Keep input leakage current within ±1μA by ensuring proper termination and signal integrity.
    • Avoid floating inputs; tie unused inputs to VDD or GND as appropriate.
  4. Output Handling:

    • Do not exceed the maximum output current of 20mA per output pin.
    • Consider using external resistors if driving inductive loads.
  5. Timing Considerations:

    • Account for propagation delay times, especially when designing high-speed circuits. At VDD = 5V, typical delay is 9ns.
  6. Power Dissipation:

    • Manage heat dissipation, especially when all outputs are active. The device can dissipate up to 120mW under these conditions.
  7. Handling Precautions:

    • Handle with care to avoid damage from electrostatic discharge (ESD).
    • Follow manufacturer guidelines for soldering and mounting to ensure reliable operation.
(For reference only)

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