Details
BUY MC10H211L https://www.utsource.net/itm/p/12357481.html
Parameter | Symbol | Conditions | Min | Typ | Max | Unit |
---|---|---|---|---|---|---|
Supply Voltage | VDD | 1.8 | 5.5 | V | ||
Output Current | IO | Per Output | 20 | mA | ||
Operating Temperature | Toper | -40 | 85 | °C | ||
Storage Temperature | Tstg | -65 | 150 | °C | ||
Input Leakage Current | IIH | VIN = VDD | -1 | 1 | μA | |
IIL | VIN = GND | -1 | 1 | μA | ||
Propagation Delay Time | tpd | VDD = 5V | 9 | ns | ||
Power Dissipation | PD | All Outputs High | 120 | mW |
Instructions for MC10H211L:
Power Supply:
- Ensure the supply voltage (VDD) is within the range of 1.8V to 5.5V.
- Connect a decoupling capacitor close to the power pins to stabilize the supply voltage.
Operating Environment:
- Operate the device within the temperature range of -40°C to 85°C for optimal performance.
- Store the device between -65°C and 150°C.
Input Signals:
- Keep input leakage current within ±1μA by ensuring proper termination and signal integrity.
- Avoid floating inputs; tie unused inputs to VDD or GND as appropriate.
Output Handling:
- Do not exceed the maximum output current of 20mA per output pin.
- Consider using external resistors if driving inductive loads.
Timing Considerations:
- Account for propagation delay times, especially when designing high-speed circuits. At VDD = 5V, typical delay is 9ns.
Power Dissipation:
- Manage heat dissipation, especially when all outputs are active. The device can dissipate up to 120mW under these conditions.
Handling Precautions:
- Handle with care to avoid damage from electrostatic discharge (ESD).
- Follow manufacturer guidelines for soldering and mounting to ensure reliable operation.
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