Details

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BUY GD75232 https://www.utsource.net/itm/p/12359739.html

Parameter	Description	Min	Typ	Max	Unit
VCC	Supply Voltage	4.5	5.0	5.5	V
IOL	Output Low Current	-16	-8	0	mA
IOH	Output High Current	0	4	8	mA
VOL	Output Low Voltage	0	0.4	0.8	V
VOH	Output High Voltage	4.2	4.4	5.0	V
VIL	Input Low Voltage	0	0.8	1.5	V
VIH	Input High Voltage	3.0	3.5	5.0	V
ICC	Supply Current (per channel)	0	0.1	1.0	mA
tPLH	Propagation Delay Time (Low to High)	5	10	15	ns
tPHL	Propagation Delay Time (High to Low)	5	10	15	ns
tPD	Propagation Delay Time (Average)	5	10	15	ns
tSKEW	Skew (Maximum Difference in tPLH and tPHL)	0	2	5	ns

Instructions for Using GD75232:

1. Supply Voltage (VCC):

   • Ensure the supply voltage is within the range of 4.5V to 5.5V to avoid damage to the device.

2. Output Current (IOL, IOH):

   • The output low current (IOL) should not exceed -16mA.
   • The output high current (IOH) should not exceed 8mA.

3. Output Voltage (VOL, VOH):

   • The output low voltage (VOL) should be between 0V and 0.8V.
   • The output high voltage (VOH) should be between 4.2V and 5.0V.

4. Input Voltage (VIL, VIH):

   • The input low voltage (VIL) should be between 0V and 1.5V.
   • The input high voltage (VIH) should be between 3.0V and 5.0V.

5. Supply Current (ICC):

   • The supply current per channel should be between 0mA and 1.0mA.

6. Propagation Delay (tPLH, tPHL, tPD):

   • The propagation delay time from low to high (tPLH) and from high to low (tPHL) should be between 5ns and 15ns.
   • The average propagation delay time (tPD) should also be between 5ns and 15ns.

7. Skew (tSKEW):

   • The maximum difference in propagation delay times (tSKEW) should not exceed 5ns.

8. Handling and Storage:

   • Handle the device with care to avoid static discharge and physical damage.
   • Store the device in a dry, cool place away from direct sunlight and corrosive materials.

9. Mounting and Soldering:

   • Use appropriate soldering techniques and temperatures to avoid damaging the device.
   • Ensure proper alignment and secure mounting on the PCB.

10. Testing:

    • Test the device under specified operating conditions to ensure it meets the required performance parameters.

(For reference only)