Details

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BUY M27C256B-15B1 https://www.utsource.net/itm/p/12359955.html

Parameter	Description	Value
Device Type	Type of Device	27C256B-15B1
Memory Size	Total Memory Capacity	32 K x 8 bits (256 Kbits)
Operating Voltage (Vcc)	Supply Voltage Range	4.5 V to 5.5 V
Access Time (tAC)	Access Time at Vcc = 5.0 V, TA = 25°C	15 ns max
Data Retention	Data Retention at Vcc = 5.0 V, TA = 25°C	10 years min
Write Cycle Time (tWC)	Write Cycle Time at Vcc = 5.0 V, TA = 25°C	Not Applicable (Read-Only Memory)
Standby Current (ISB)	Standby Current at Vcc = 5.0 V, TA = 25°C	50 μA max
Active Current (IAV)	Active Current at Vcc = 5.0 V, TA = 25°C	25 mA max
Operating Temperature Range (TA)	Operating Temperature Range	-40°C to +85°C
Storage Temperature Range (TSTG)	Storage Temperature Range	-65°C to +150°C
Package Type	Package Type	DIP-28 or PLCC-32
Pin Configuration	Pin Configuration	28-pin DIP or 32-pin PLCC

Instructions for Use

1. Power Supply:

   • Ensure that the supply voltage (Vcc) is within the specified range of 4.5 V to 5.5 V.
   • Connect the ground (GND) pin to a stable ground reference.

2. Addressing:

   • The device has 15 address lines (A0 to A14) to select one of the 32,768 memory locations.
   • Address lines should be driven by a stable and noise-free source.

3. Data Input/Output:

   • The device has 8 data lines (D0 to D7) for reading data from the memory.
   • Data lines should be connected to the data bus of the system.

4. Control Signals:

   • Chip Select (CS): Low active signal to enable the device.
   • Output Enable (OE): Low active signal to enable data output.
   • Write Protect (WP): High active signal to prevent accidental writes (not applicable for ROM).

5. Timing:

   • Ensure that the access time (tAC) is not exceeded. The maximum access time is 15 ns at Vcc = 5.0 V and TA = 25°C.
   • The device does not require any write cycle time as it is a read-only memory.

6. Temperature Considerations:

   • Operate the device within the specified temperature range (-40°C to +85°C) to ensure reliable performance.
   • Store the device within the storage temperature range (-65°C to +150°C).

7. Handling:

   • Handle the device with care to avoid damage to the pins and internal circuits.
   • Follow proper ESD (Electrostatic Discharge) precautions to prevent damage from static electricity.

8. Testing:

   • Before integrating the device into a system, perform functional tests to verify its operation.
   • Use a known good test pattern to validate the memory contents and access times.

9. Mounting:

   • For DIP-28 packages, use a standard dual-inline socket or solder directly to the PCB.
   • For PLCC-32 packages, use a suitable PLCC socket or surface mount technology (SMT) for PCB mounting.

10. Documentation:

    • Refer to the datasheet and application notes for detailed information and specific use cases.
    • Keep the documentation accessible for future reference and troubleshooting.

(For reference only)