Details
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Parameter | Symbol | Min | Typical | Max | Unit |
---|---|---|---|---|---|
Input Voltage | VIN | 4.5 | - | 40 | V |
Continuous Current | IOUT | - | 30 | 35 | A |
Peak Current | IPEAK | - | 60 | - | A |
On-State Resistance | RON | - | 2.8 | - | m惟 |
Off-State Leakage | ILEAK | - | 10 | - | 渭A |
Thermal Resistance | RTH | - | 0.7 | - | 掳C/W |
Operating Temperature | TOPR | -40 | - | 125 | 掳C |
Storage Temperature | TSTG | -40 | - | 150 | 掳C |
Instructions for Use:
Power Supply:
- Ensure the input voltage (VIN) is within the specified range of 4.5V to 40V.
Current Handling:
- The device can handle a continuous current (IOUT) up to 30A, with a peak current (IPEAK) capability of 60A. Do not exceed these limits to avoid damage.
Thermal Management:
- The on-state resistance (RON) is typically 2.8 m惟, which will generate heat during operation. Use appropriate heatsinking to manage the thermal resistance (RTH) of 0.7掳C/W and keep the operating temperature (TOPR) below 125掳C.
Leakage Current:
- The off-state leakage current (ILEAK) is typically 10 渭A. This is normal and should be accounted for in your circuit design.
Temperature Range:
- The device can operate within a temperature range of -40掳C to 125掳C (operating temperature, TOPR) and can be stored between -40掳C and 150掳C (storage temperature, TSTG).
Mounting and Handling:
- Handle the device with care to avoid mechanical stress or damage. Follow standard ESD (Electrostatic Discharge) precautions during handling and installation.
Testing:
- Before integrating the device into your final application, perform thorough testing under typical operating conditions to ensure it meets your requirements.
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