Details

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BUY NLSX3018DTR2G https://www.utsource.net/itm/p/12360606.html

Parameter	Symbol	Min	Typical	Max	Unit
Supply Voltage	VDD	1.6	-	5.5	V
Output Current (High Level)	IOH	-	10	20	mA
Output Current (Low Level)	IOL	10	-	20	mA
Input Leakage Current	IIH	-	1	5	μA
Output Leakage Current	IOLH	-	1	5	μA
Propagation Delay Time	tpd	2	-	7	ns
Power Dissipation	PD	-	-	150	mW
Operating Temperature	Ta	-40	-	125	°C
Storage Temperature	Tstg	-65	-	150	°C

Instructions for Use:

1. Supply Voltage:

   • Ensure the supply voltage (VDD) is within the range of 1.6V to 5.5V.
   • Avoid exceeding the maximum voltage to prevent damage to the device.

2. Output Current:

   • The device can source up to 20mA (IOH) and sink up to 20mA (IOL).
   • Ensure that the load connected to the output does not exceed these limits.

3. Input Leakage Current:

   • The input leakage current (IIH) should be kept below 5μA to maintain proper operation.
   • Use appropriate pull-up or pull-down resistors if necessary.

4. Output Leakage Current:

   • The output leakage current (IOLH) should be kept below 5μA to ensure reliable switching.

5. Propagation Delay:

   • The propagation delay time (tpd) is typically between 2ns and 7ns.
   • This parameter is crucial for timing-sensitive applications.

6. Power Dissipation:

   • The maximum power dissipation (PD) is 150mW.
   • Ensure adequate heat dissipation if operating near this limit.

7. Operating Temperature:

   • The device is designed to operate within the temperature range of -40°C to 125°C.
   • Avoid exposing the device to temperatures outside this range to prevent failure.

8. Storage Temperature:

   • Store the device in an environment with a temperature range of -65°C to 150°C.
   • Proper storage conditions help maintain the reliability and longevity of the device.

9. Handling:

   • Handle the device with care to avoid static discharge, which can damage the sensitive components.
   • Use anti-static wrist straps and mats when handling the device.

10. Mounting:

    • Follow the recommended PCB layout guidelines to ensure optimal performance and reliability.
    • Use appropriate soldering techniques and temperatures to avoid thermal damage during assembly.

(For reference only)