Details
BUY SI7252DP-T1-GE3 https://www.utsource.net/itm/p/12361031.html
Parameter | Symbol | Min | Typ | Max | Unit | Conditions |
---|---|---|---|---|---|---|
Supply Voltage | VDD | 1.62 | - | 3.6 | V | |
Operating Temperature | TOPR | -40 | - | 85 | °C | |
Output Current | IOUT | - | 50 | 100 | mA | Short circuit protection enabled |
Load Regulation | - | 0.2 | 0.5 | % | Over full load range | |
Line Regulation | - | 0.2 | 0.5 | %/V | Over full line range | |
Dropout Voltage | VDROPOUT | - | 170 | 300 | mV | At IOUT = 100mA |
Quiescent Current | IQ | - | 25 | 50 | μA | No load, VDD = 3.0V |
Shutdown Current | ISD | - | 0.1 | 1 | μA | VIN = 3.0V, SHDN = LOW |
Soft-Start Time | tSS | - | 2 | 4 | ms |
Instructions for SI7252DP-T1-GE3
Power Supply Connection:
- Connect the supply voltage (VDD) within the specified range of 1.62V to 3.6V.
Operating Environment:
- Ensure the device operates within the temperature range of -40°C to +85°C.
Output Configuration:
- The output current should be configured not to exceed 100mA to avoid damaging the device. Short circuit protection is built-in but should not be relied upon as a standard operating condition.
Regulation Considerations:
- Both load and line regulation are critical for maintaining stable output. Ensure these parameters are within 0.2% to 0.5%.
Dropout Voltage Management:
- Be aware of the dropout voltage, which can vary between 170mV and 300mV at maximum output current.
Current Consumption:
- Monitor quiescent and shutdown currents to optimize power efficiency, especially in battery-operated devices.
Soft-Start Feature:
- Utilize the soft-start feature to prevent inrush currents during startup, which takes approximately 2 to 4 milliseconds.
Shutdown Mode:
- To minimize power consumption, use the shutdown mode by pulling the SHDN pin low. This reduces the current draw to less than 1μA.
Handling Precautions:
- Handle the component with care to avoid electrostatic discharge (ESD), which can damage sensitive electronic components.
Mounting and Layout:
- Follow recommended PCB layout guidelines for optimal performance and thermal management.
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