Details

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BUY ICL7611DCPA https://www.utsource.net/itm/p/12379376.html

Parameter	Symbol	Conditions	Min	Typ	Max	Unit
Supply Voltage	VCC	-	2.0	5.0	18.0	V
Operating Temperature	TA	-	-40	-	85	掳C
Storage Temperature	TSTG	-	-65	-	150	掳C
Input Voltage Range	VI	-	0	-	VCC	V
Output Current (Sink)	IOL	VO = 0.4V	10	20	30	mA
Output Current (Source)	IOH	VO = VCC - 0.4V	10	20	30	mA
Quiescent Current	IQ	-	0.1	0.5	1.0	渭A
Propagation Delay Time	td	VCC = 5V, VI = 2.5V, VO = 2.5V	100	200	300	ns
Power Dissipation	PD	-	-	-	180	mW

Instructions for Use:

1. Supply Voltage:

   • Ensure the supply voltage is within the range of 2.0V to 18.0V.
   • Avoid exceeding the maximum supply voltage to prevent damage to the device.

2. Temperature Considerations:

   • The operating temperature range is from -40掳C to 85掳C.
   • Store the device in an environment where the temperature does not exceed -65掳C to 150掳C.

3. Input Voltage:

   • The input voltage should be between 0V and the supply voltage (V_CC).

4. Output Current:

   • The device can sink or source up to 30mA of current.
   • Ensure that the load connected to the output does not exceed these limits to avoid damage.

5. Quiescent Current:

   • The quiescent current is very low, typically ranging from 0.1渭A to 1.0渭A.
   • This makes the device suitable for battery-operated applications.

6. Propagation Delay:

   • The propagation delay time is the time it takes for the output to respond to a change in the input.
   • At a supply voltage of 5V, the typical delay is around 200ns.

7. Power Dissipation:

   • The maximum power dissipation is 180mW.
   • Ensure adequate heat dissipation if the device is expected to operate near this limit.

8. Handling:

   • Handle the device with care to avoid static discharge, which can damage sensitive components.
   • Use appropriate ESD protection measures during handling and installation.

9. Mounting:

   • Follow standard surface mount technology (SMT) procedures for mounting the device on a PCB.
   • Ensure proper soldering to avoid cold solder joints and ensure reliable operation.

10. Testing:

    • Before final assembly, test the device to ensure it meets the specified parameters.
    • Use a multimeter to check for short circuits and open circuits.

(For reference only)