Details

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BUY SKIIP23NAB12T4V1 https://www.utsource.net/itm/p/12380264.html

Parameter	Symbol	Min	Typ	Max	Unit	Description
Continuous Drain Current	ID	-	1200	-	A	At Tc = 25°C, VGS = 15V
Pulsed Drain Current	IGM	-	2400	-	A	t = 10 μs, I2t = 6.72 A2s, VGS = 15V
Drain-Source Breakdown Voltage	BVDSS	1600	-	1800	V	VGS = 0V, ID = 250 μA
Gate-Source Voltage	VGS	-20	-	20	V	-
Gate Threshold Voltage	VGS(th)	2.0	4.0	6.0	V	ID = 250 mA, Tc = 25°C
On-State Resistance	RDS(on)	-	0.018	-	Ω	VGS = 15V, ID = 1200A, Tc = 25°C
Total Switching Energy	Esw	-	140	-	mJ	VDS = 800V, ID = 1200A, f = 1 kHz, VGS = ±15V
Input Capacitance	Ciss	-	13400	-	pF	VDS = 400V, f = 1 MHz
Output Capacitance	Coss	-	1150	-	pF	VDS = 400V, f = 1 MHz
Reverse Transfer Capacitance	Crss	-	1250	-	pF	VDS = 400V, f = 1 MHz
Junction Temperature	TJ	-55	-	175	°C	Operating range
Storage Temperature	TSTG	-55	-	150	°C	Operating range

Instructions for Use:

1. Mounting and Handling:

   • Ensure proper heat sinking to maintain the junction temperature within the specified limits.
   • Handle the device with care to avoid damage to the leads and the die.

2. Electrical Connections:

   • Connect the drain (D), source (S), and gate (G) terminals correctly to the circuit.
   • Use short and wide leads to minimize inductance and improve high-frequency performance.

3. Gate Drive:

   • Apply a gate-source voltage (VGS) within the specified range to turn the device on or off.
   • Use a gate resistor to control the switching speed and reduce electromagnetic interference (EMI).

4. Thermal Management:

   • Ensure adequate cooling to keep the junction temperature below the maximum limit.
   • Use thermal paste or thermal interface materials between the device and the heatsink for better thermal conductivity.

5. Overvoltage Protection:

   • Implement overvoltage protection circuits to prevent damage from transient voltages exceeding the breakdown voltage (BVDSS).

6. Surge Current Handling:

   • Design the circuit to handle pulsed currents (IGM) without exceeding the safe operating area (SOA).

7. Testing and Verification:

   • Test the device under actual operating conditions to ensure it meets the required performance specifications.
   • Verify the thermal design by measuring the junction temperature during operation.

8. Storage:

   • Store the device in a dry, cool place away from direct sunlight and sources of heat.
   • Follow anti-static precautions to avoid damage to the device.

(For reference only)