Details

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BUY XCF04SVOG20C https://www.utsource.net/itm/p/12380789.html

Parameter	Description	Value
Device Type	FPGA Configuration Memory	XCF04SVOG20C
Memory Size	Total Memory Capacity	4 Mbit
Voltage Supply	VCC (Operating Voltage)	1.8V ± 0.15V
Data Width	Data Bus Width	8-bit
Package	Package Type	TQFP-44
Operating Temperature	Industrial Temperature Range	-40°C to +85°C
Programming Interface	JTAG, BPI (Byte Parallel Interface), SPI (Serial Peripheral Interface)	Supported
Write Cycle Time	Time to Program a Single Byte	1 ms (max)
Erase Cycle Time	Time to Erase the Entire Device	5 s (max)
Endurance	Number of Write/Erase Cycles	100,000 cycles
Data Retention	Minimum Data Retention Time	20 years
Clock Frequency	Maximum Clock Frequency for SPI/JTAG	25 MHz
Standby Current	Current Consumption in Standby Mode	1 μA (max)
Active Current	Current Consumption in Active Mode	10 mA (max)

Instructions for Use

1. Power Supply:

   • Ensure that the V_CC supply voltage is within the specified range of 1.8V ± 0.15V.
   • Connect the ground (GND) pin to a stable ground reference.

2. Programming:

   • Use a compatible programmer or development environment to program the device.
   • Support for JTAG, BPI, and SPI interfaces allows for flexible programming options.
   • For JTAG, connect the TDI, TDO, TCK, and TMS pins as per the JTAG standard.
   • For BPI, connect the data, address, and control lines as specified in the datasheet.
   • For SPI, connect the SCLK, MOSI, MISO, and CS pins as required.

3. Erasing:

   • The entire device can be erased using the appropriate command via the programming interface.
   • Ensure that the erase cycle time of 5 seconds (maximum) is observed to avoid data corruption.

4. Reading:

   • Data can be read from the device using the same programming interfaces.
   • Ensure that the read cycle time is within the device specifications.

5. Endurance and Data Retention:

   • The device supports up to 100,000 write/erase cycles.
   • Data retention is guaranteed for at least 20 years under normal operating conditions.

6. Handling:

   • Handle the device with care to avoid static discharge.
   • Follow ESD (Electrostatic Discharge) precautions when handling the device.

7. Storage:

   • Store the device in a dry, cool place to ensure long-term reliability.
   • Avoid exposure to extreme temperatures and humidity.

8. Pin Configuration:

   • Refer to the pinout diagram in the datasheet for correct pin connections.
   • Ensure all unused pins are tied to the appropriate state (high or low) as specified.

9. Testing:

   • After programming, verify the contents of the device using a read-back operation.
   • Test the device in the target system to ensure proper functionality.

For detailed information, refer to the device datasheet and application notes provided by the manufacturer.

(For reference only)