SKM400GB126D

SKM400GB126D

Category: Modules

Specifications
SKU
12380904
Details

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Parameter Symbol Min Typical Max Unit Notes
Rated Voltage (Collector-Emitter) VCES - 1200 - V
Rated Current (Collector) IC - 400 - A
Continuous Collector-Emitter Power Dissipation PCE - 3600 - W @ Tc = 25°C
Junction to Case Thermal Resistance RthJC - 0.018 - K/W
Junction to Ambient Thermal Resistance RthJA - 0.3 - K/W @ Free Air
Maximum Junction Temperature TJmax - - 175 °C
Storage Temperature Range Tstg -55 - 150 °C
Turn-On Time ton - 0.7 1.0 μs @ IC = 400A, VGE = 15V
Turn-Off Time toff - 0.8 1.2 μs @ IC = 400A, VGE = -15V
Gate-Emitter Voltage (Turn-On) VGE(th) 4.5 5.5 6.5 V @ IC = 10A, dIC/dt = 500A/μs
Gate-Emitter Voltage (Turn-Off) VGE(off) -15 - -15 V @ IC = 400A, dIC/dt = 500A/μs

Instructions for Use:

  1. Mounting:

    • Ensure proper heat sinking to maintain junction temperature within specified limits.
    • Use thermal paste between the device and the heat sink to improve thermal conductivity.
  2. Electrical Connections:

    • Connect the collector to the load.
    • Connect the emitter to the common ground.
    • Apply gate signals through a suitable driver circuit to control turn-on and turn-off times.
  3. Thermal Management:

    • Monitor the junction temperature to avoid exceeding the maximum allowable temperature.
    • Use forced air cooling or liquid cooling if necessary to keep the device within safe operating limits.
  4. Gate Drive:

    • Use a gate resistor to limit the current during switching.
    • Ensure the gate voltage is within the specified range to prevent damage to the device.
  5. Storage and Handling:

    • Store the device in a dry, cool place away from direct sunlight.
    • Handle with care to avoid mechanical stress or damage to the pins.
  6. Safety Precautions:

    • Always use appropriate safety equipment when handling high-voltage and high-current circuits.
    • Follow all relevant electrical and safety standards during installation and operation.
  7. Testing:

    • Perform initial testing at low power levels to ensure correct operation before moving to full load conditions.
    • Regularly inspect the device and connections for signs of wear or damage.
(For reference only)

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