Details

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BUY XC95288XL-10TQG144C https://www.utsource.net/itm/p/12381094.html

Parameter	Description	Value
Device	High-Density, Low-Cost CPLD	XC95288XL-10TQG144C
Package	TQFP (Thin Quad Flat Package)	144-Pin
Operating Temperature Range	Industrial Temperature Range	-40°C to +85°C
Supply Voltage (VCC)	Operating Supply Voltage	3.3V ± 5%
I/O Voltage	Input/Output Voltage	3.3V ± 5%
Logic Cells	Number of Logic Cells	288
Macrocells	Number of Macrocells	144
User I/O Pins	Number of User I/O Pins	112
Internal RAM (Bits)	Internal RAM Size	2880 bits
Maximum Frequency	Maximum Operating Frequency	333 MHz (typical)
Configuration Memory	Configuration Memory Type	Non-Volatile Flash
Programming Method	Programming Method	In-System Programmable (ISP)
Configuration Modes	Configuration Modes	Master Serial, Slave Serial, Master Parallel, Slave Parallel, JTAG
Power Consumption	Typical Power Consumption (Active)	100 mW
Standby Current	Standby Current	1 μA
ESD Protection	Electrostatic Discharge Protection	HBM: 2000 V, MM: 200 V, CDM: 1000 V
Lead-Free	Lead-Free Compliance	Yes
RoHS Compliant	RoHS Compliance	Yes

Instructions for Use

1. Power Supply Connection:

   • Connect the VCC pin to a 3.3V power supply.
   • Ensure that the ground (GND) pins are connected to a common ground.

2. Configuration:

   • The device can be configured using various modes: Master Serial, Slave Serial, Master Parallel, Slave Parallel, or JTAG.
   • Use the appropriate configuration software provided by Xilinx to program the device.

3. Input/Output Handling:

   • Ensure that all I/O pins are properly terminated to avoid floating inputs.
   • Use pull-up or pull-down resistors as needed for proper signal levels.

4. Programming:

   • Use the Xilinx iMPACT software or another compatible programming tool to load the configuration file into the device.
   • Follow the programming sequence specified in the Xilinx documentation to ensure successful configuration.

5. Testing:

   • After programming, test the device to verify correct operation.
   • Use boundary-scan (JTAG) testing for functional verification and debugging.

6. Handling and Storage:

   • Handle the device with care to avoid ESD damage.
   • Store the device in a dry, ESD-safe environment.

7. Documentation:

   • Refer to the Xilinx datasheet and user guide for detailed information on device specifications, programming, and application notes.

For more detailed information, refer to the official Xilinx documentation for the XC95288XL-10TQG144C.

(For reference only)