Details

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BUY TLP180 https://www.utsource.net/itm/p/12381211.html

Parameter	Symbol	Min	Typ	Max	Unit
Forward Voltage (IF=20mA)	VF	1.0	1.2	1.4	V
Reverse Voltage	VR	-	-	5	V
Peak Forward Current	IF(surge)	-	-	100	mA
Continuous Forward Current	IF	-	20	30	mA
Output Collector-Emitter Voltage (VCE)	VCE	-	-	30	V
Output Collector Current (IC)	IC	-	50	100	mA
Isolation Voltage	VI	-	-	5000	Vrms
Operating Temperature Range	TA	-40	-	110	掳C
Storage Temperature Range	TSTG	-40	-	125	掳C

Instructions for Using TLP180

1. Forward Voltage (V_F):

   • Ensure that the forward voltage across the LED does not exceed 1.4V when operating at 20mA.

2. Reverse Voltage (V_R):

   • The device can withstand up to 5V in reverse bias without damage.

3. Peak Forward Current (I_F(surge)):

   • The peak forward current should not exceed 100mA to avoid damaging the LED.

4. Continuous Forward Current (I_F):

   • The continuous forward current should be kept between 20mA and 30mA for reliable operation.

5. Output Collector-Emitter Voltage (V_CE):

   • The maximum collector-emitter voltage should not exceed 30V.

6. Output Collector Current (I_C):

   • The output collector current should be kept between 50mA and 100mA.

7. Isolation Voltage (V_I):

   • The isolation voltage is rated at 5000Vrms, ensuring high electrical isolation between the input and output.

8. Operating Temperature Range (T_A):

   • The device can operate reliably within a temperature range of -40掳C to 110掳C.

9. Storage Temperature Range (T_STG):

   • The device can be stored in temperatures ranging from -40掳C to 125掳C without degradation.

10. Handling Precautions:

    • Handle the device with care to avoid static discharge, which can damage the internal components.
    • Ensure proper heat dissipation if operating at higher currents or temperatures.
    • Follow recommended PCB layout guidelines to ensure optimal performance and reliability.

11. Mounting:

    • Use appropriate soldering techniques and temperatures to avoid thermal shock.
    • Ensure the device is securely mounted to prevent mechanical stress.

12. Testing:

    • Test the device under controlled conditions to verify its performance before integrating it into the final application.

(For reference only)