Details

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BUY CY8C20636A-24LTXIT https://www.utsource.net/itm/p/12382833.html

Parameter	Description	Value
Device	Device Name	CY8C20636A-24LTXIT
Package	Package Type	TSSOP-24
Operating Voltage (Vdd)	Supply Voltage Range	2.7 V to 5.5 V
Operating Temperature (Tamb)	Ambient Operating Temperature Range	-40°C to +85°C
Clock Frequency	Maximum Clock Frequency	24 MHz
Flash Memory	Program Memory Size	32 KB
SRAM	Data Memory Size	2 KB
I/O Pins	Number of I/O Pins	20
Programmable Analog Blocks (PABs)	Number of PABs	4
Programmable Digital Blocks (PDBs)	Number of PDBs	16
Capacitive Sensing Channels	Number of Capacitive Sensing Channels	16
ADC Resolution	Analog-to-Digital Converter Resolution	12-bit
DAC Resolution	Digital-to-Analog Converter Resolution	8-bit
Communication Interfaces	Supported Communication Interfaces	I2C, SPI, UART
Power Consumption	Active Mode Current	200 μA/MHz
Power Consumption	Sleep Mode Current	1 μA
Programming Interface	In-System Programming Interface	SPI, I2C, UART
ESD Protection	Electrostatic Discharge Protection	HBM: ±2 kV, MM: ±200 V
Certifications	Compliance Certifications	RoHS, WEEE

Instructions for Use

1. Power Supply:

   • Ensure the supply voltage (Vdd) is within the range of 2.7 V to 5.5 V.
   • Connect the Vss pin to ground.

2. Clock Configuration:

   • The device supports an external crystal or oscillator up to 24 MHz.
   • Internal clock sources are also available.

3. Programming:

   • Use the SPI, I2C, or UART interface for in-system programming.
   • Follow the programming guidelines provided in the device datasheet.

4. Capacitive Sensing:

   • Configure the capacitive sensing channels using the PSoC Designer software.
   • Calibrate the sensors for optimal performance.

5. Analog and Digital Peripherals:

   • Utilize the PABs and PDBs to configure analog and digital functions.
   • Refer to the datasheet for detailed configuration options.

6. Communication Interfaces:

   • Set up the I2C, SPI, or UART interfaces as required by your application.
   • Configure baud rates and other parameters according to the communication protocol.

7. Power Management:

   • Implement sleep modes to reduce power consumption when the device is not actively processing.
   • Use the appropriate sleep and wake-up commands to manage power efficiently.

8. ESD Protection:

   • Handle the device with care to avoid electrostatic discharge.
   • Use proper ESD protection equipment and procedures during handling and assembly.

9. Design Considerations:

   • Ensure proper PCB layout and grounding to minimize noise and interference.
   • Follow the recommended decoupling capacitor placement and values.

For more detailed information, refer to the CY8C20636A-24LTXIT datasheet and application notes.

(For reference only)