Details

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BUY ATF1508AS-10JU84 https://www.utsource.net/itm/p/12382903.html

Parameter	Description	Value
Device Type	Type of Device	Complex Programmable Logic Device (CPLD)
Family	Device Family	ATF15xxA
Part Number	Specific Part Number	ATF1508AS-10JU84
Package	Package Type	84-Pin TQFP (Thin Quad Flat Package)
Speed Grade	Speed Grade	-10 (10 ns)
Supply Voltage (Vcc)	Operating Supply Voltage	3.3V ± 0.3V
I/O Voltage (VccIO)	Input/Output Supply Voltage	3.3V ± 0.3V or 5V ± 0.25V (5V-tolerant)
Maximum Frequency (fMAX)	Maximum Clock Frequency	100 MHz
Number of Macrocells	Number of Macrocells	80
Number of I/O Pins	Number of I/O Pins	64
Internal RAM (Bits)	Internal RAM Size	2560 bits
Configuration Memory (Bits)	Configuration Memory Size	17920 bits
Operating Temperature Range	Operating Temperature Range	-40°C to +85°C
Storage Temperature Range	Storage Temperature Range	-65°C to +150°C
Programming Method	Programming Method	ISP (In-System Programming) via JTAG or AS (Active Serial)
Configuration Time	Configuration Time	< 1 ms (typical)
Standby Current	Standby Current (Vcc = 3.3V, VccIO = 3.3V)	10 μA (max)
Active Power Consumption	Active Power Consumption (Vcc = 3.3V, VccIO = 3.3V)	100 mW (typical)
ESD Protection	Electrostatic Discharge Protection	HBM: 2000V, MM: 200V
RoHS Compliance	RoHS Compliance	Yes
Lead-Free	Lead-Free	Yes

Instructions for Use:

1. Power Supply:

   • Ensure that the supply voltage (Vcc) is within the specified range of 3.3V ± 0.3V.
   • For I/O pins, use either 3.3V ± 0.3V or 5V ± 0.25V, depending on the application requirements.

2. Configuration:

   • The device can be programmed using In-System Programming (ISP) via JTAG or Active Serial (AS) methods.
   • Configuration time is typically less than 1 ms.

3. Temperature Considerations:

   • Operate the device within the temperature range of -40°C to +85°C.
   • Store the device in an environment with a temperature range of -65°C to +150°C.

4. Power Consumption:

   • Standby current should not exceed 10 μA at 3.3V.
   • Active power consumption is typically around 100 mW at 3.3V.

5. ESD Protection:

   • Handle the device with care to avoid ESD damage. The device has HBM ESD protection up to 2000V and MM ESD protection up to 200V.

6. Environmental Compliance:

   • The device is RoHS compliant and lead-free.

7. Mounting and Handling:

   • Use standard surface mount technology (SMT) for mounting the device.
   • Follow recommended reflow soldering profiles to ensure reliable solder joints.

8. Testing and Verification:

   • After programming, verify the configuration and functionality of the device using appropriate test vectors and boundary scan techniques.

9. Documentation:

   • Refer to the datasheet and application notes for detailed information on device features, pinouts, and programming procedures.

(For reference only)