Details

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Parameter	Description	Value
Part Number	Product part number	PCI2050PDVG4
Package Type	Type of package	TSSOP-16
Operating Voltage	Range of operating voltage	2.7V to 5.5V
Operating Temperature	Range of operating temperature	-40°C to 85°C
Interface	Type of interface	I2C
Data Rate	Maximum data rate	400 kbps
Supply Current	Typical supply current at 3.3V	1.5 mA
Standby Current	Typical standby current	0.5 μA
Input Capacitance	Capacitance of input pins	10 pF
Output Capacitance	Capacitance of output pins	10 pF
ESD Protection	Electrostatic discharge protection	±4 kV (HBM)
RoHS Compliance	Compliance with Restriction of Hazardous Substances directive	Yes

Instructions for Use

1. Power Supply:

   • Connect the VCC pin to the power supply within the specified range (2.7V to 5.5V).
   • Connect the GND pin to the ground.

2. I2C Interface:

   • Connect the SDA (Serial Data) and SCL (Serial Clock) pins to the I2C bus.
   • Ensure pull-up resistors are connected to both SDA and SCL lines. Typical values are 4.7kΩ to 10kΩ, depending on the bus length and speed.

3. Address Configuration:

   • The device address can be configured using the A0, A1, and A2 pins. Refer to the datasheet for specific address settings.

4. Initialization:

   • After powering the device, initialize the I2C communication by sending the appropriate start condition, device address, and write/read commands.

5. Data Transmission:

   • For writing data, send the start condition, device address, and data bytes.
   • For reading data, send the start condition, device address, and read commands followed by the acknowledgment or not acknowledgment (NACK) bit.

6. Standby Mode:

   • To enter standby mode, set the appropriate control register bit as specified in the datasheet. This reduces the current consumption to the typical standby current.

7. ESD Handling:

   • Handle the device with care to avoid electrostatic discharge. Use ESD-safe equipment and follow standard ESD handling procedures.

8. Mounting:

   • Mount the device on a PCB using standard surface mount technology (SMT) processes. Ensure proper soldering and alignment to avoid mechanical stress on the pins.

9. Testing:

   • After mounting, verify the functionality of the device by performing basic I2C communication tests. Check the supply current and standby current to ensure they are within the specified limits.

For detailed specifications and advanced features, refer to the full datasheet provided by the manufacturer.

(For reference only)