Details

---

BUY IR2105 https://www.utsource.net/itm/p/12394506.html

Parameter	Symbol	Min	Typ	Max	Unit	Conditions
Supply Voltage	VCC	10	-	20	V
High-Side Driver Supply	VB	10	-	600	V
Input Voltage (High)	VIH	2.0	-	7.0	V
Input Voltage (Low)	VIL	0.8	-	2.0	V
Output Current	IOUT	-	2.0	-	A
Operating Temperature	TA	-40	-	125	°C
Storage Temperature	TSTG	-65	-	150	°C
Power Dissipation	PD	-	-	1.0	W

Instructions for Use:

1. Supply Voltage (V_CC):

   • Ensure the supply voltage is within the range of 10V to 20V.
   • Exceeding this range can damage the device.

2. High-Side Driver Supply (V_B):

   • The high-side driver supply should be between 10V and 600V.
   • This voltage must be higher than the source voltage of the high-side MOSFET to ensure proper operation.

3. Input Voltage Levels:

   • High input voltage (V_IH) should be between 2.0V and 7.0V.
   • Low input voltage (V_IL) should be between 0.8V and 2.0V.
   • These levels determine the logic state of the inputs.

4. Output Current (I_OUT):

   • The output current should not exceed 2.0A.
   • Higher currents can lead to overheating and potential damage.

5. Operating Temperature (T_A):

   • The device should operate within the temperature range of -40°C to 125°C.
   • Operating outside this range can affect performance and reliability.

6. Storage Temperature (T_STG):

   • Store the device in temperatures ranging from -65°C to 150°C.
   • Extreme temperatures can degrade the device over time.

7. Power Dissipation (P_D):

   • The maximum power dissipation is 1.0W.
   • Ensure adequate heat sinking or cooling if operating near this limit.

8. Bootstrap Capacitor:

   • Use a bootstrap capacitor to maintain the high-side gate drive voltage.
   • The capacitor should be placed close to the IR2105 to minimize parasitic inductance.

9. Dead Time:

   • Implement dead time between high-side and low-side switching to prevent shoot-through current.
   • This can be achieved using external resistors or by configuring the internal dead-time control.

10. Layout Considerations:

    • Keep high-frequency signal traces short and direct.
    • Use ground planes to reduce noise and improve stability.

11. Protection Circuits:

    • Incorporate overvoltage and overcurrent protection circuits to safeguard the device.
    • Use appropriate fuses and diodes as needed.

12. Testing:

    • Test the circuit under various conditions to ensure reliable operation.
    • Monitor temperature and current to avoid exceeding safe limits.

(For reference only)