Details

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BUY MC74HC14ADR2G https://www.utsource.net/itm/p/12398999.html

Parameter	Symbol	Min	Typical	Max	Unit	Conditions
Supply Voltage	VCC	2.0	-	6.0	V
Input Low Voltage	VIL	-	0.8	-	V	VCC = 4.5V to 5.5V
Input High Voltage	VIH	-	2.0	-	V	VCC = 4.5V to 5.5V
Output Low Voltage	VOL	-	0.1	0.4	V	IOL = 4 mA, VCC = 4.5V to 5.5V
Output High Voltage	VOH	2.4	-	5.0	V	IOH = -0.4 mA, VCC = 4.5V to 5.5V
Propagation Delay Time	tpd	-	12	24	ns	VCC = 4.5V to 5.5V, TA = 25°C
Power Dissipation	Ptot	-	-	500	mW	Per Package
Operating Temperature	TOP	-40	-	85	°C
Storage Temperature	TSTG	-65	-	150	°C

Instructions for Use:

1. Supply Voltage (V_CC):

   • The device operates with a supply voltage range from 2.0V to 6.0V. Ensure the power supply is within this range to avoid damage.

2. Input Levels:

   • For reliable operation, ensure that input voltages are within the specified ranges:
     • Input Low (V_IL) should be less than or equal to 0.8V.
     • Input High (V_IH) should be greater than or equal to 2.0V.

3. Output Levels:

   • The output low voltage (V_OL) should not exceed 0.4V when sinking 4 mA.
   • The output high voltage (V_OH) should be at least 2.4V when sourcing -0.4 mA.

4. Propagation Delay:

   • The propagation delay time (t_pd) is typically 12 ns and can be up to 24 ns under standard conditions (V_CC = 4.5V to 5.5V, T_A = 25°C).

5. Power Dissipation:

   • The maximum power dissipation per package is 500 mW. Ensure adequate heat dissipation to prevent overheating.

6. Operating and Storage Temperatures:

   • The operating temperature range is from -40°C to 85°C.
   • The storage temperature range is from -65°C to 150°C.

7. Handling Precautions:

   • Handle the device with care to avoid static discharge, which can damage the internal components.
   • Use appropriate ESD protection measures during handling and installation.

8. Mounting:

   • Follow recommended soldering profiles and mounting guidelines to ensure proper attachment and functionality.
   • Avoid excessive thermal stress during soldering.

9. Testing:

   • Before integrating the device into a circuit, perform initial tests to verify its functionality and performance parameters.

10. Documentation:

    • Refer to the datasheet for detailed specifications, pin configurations, and application notes.

(For reference only)