A3P250-PQG208

A3P250-PQG208

Category: IC Chips

Specifications
Details

BUY A3P250-PQG208 https://www.utsource.net/itm/p/12399255.html

Parameter Description
Package Type PQG208
Pin Count 208
Operating Temperature -40°C to +125°C
Supply Voltage (Vcc) 1.62V to 3.6V
I/O Voltage 1.2V, 1.8V, 2.5V, 3.3V
Clock Frequency Up to 200 MHz
Configuration Memory 2Mbit (256K x 8)
Logic Cells 250K
Block RAM 960 Kbits
Multiplier Blocks 120
DCM (Digital Clock Manager) 8
I/O Banks 16
Package Body Size 35 mm × 35 mm
Pitch 0.8 mm

Instructions for Handling and Usage:

  1. Storage Conditions: Store in a dry environment with controlled humidity levels. Avoid exposure to moisture which can lead to damage during reflow soldering.

  2. Handling: Use appropriate ESD protection measures. The device is sensitive to static electricity.

  3. Soldering Profile: Follow the recommended reflow profile for PQG packages. Ensure peak temperature does not exceed 260°C for more than 10 seconds.

  4. Power-Up Sequence: Apply Vcc first, followed by other power supplies as specified in the datasheet. Ensure stable power supply before applying any clock signals.

  5. Programming: Use compatible programming hardware and software tools. Verify the configuration data before committing it to the device.

  6. Testing: After assembly, perform functional tests under specified operating conditions to ensure proper operation.

  7. Documentation Review: Always refer to the latest datasheet and application notes provided by the manufacturer for detailed specifications and guidelines.

(For reference only)

View more about A3P250-PQG208 on main site