Details

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BUY SN65LBC173ADR https://www.utsource.net/itm/p/12399496.html

Parameter	Symbol	Conditions	Min	Typ	Max	Unit
Supply Voltage	VCC	Operating	2.3	-	5.5	V
Output High Voltage	VOH	IOL = -4 mA, VCC = 5 V	2.4	-	5.0	V
Output Low Voltage	VOL	IOL = 16 mA, VCC = 5 V	0.0	-	0.4	V
Input High Voltage	VIH	-	2.0	-	5.5	V
Input Low Voltage	VIL	-	0.0	-	0.8	V
Propagation Delay Time (High to Low)	tPLH	VCC = 5 V, VO = 2.4 V, VI = 3.5 V, CL = 15 pF	-	10	-	ns
Propagation Delay Time (Low to High)	tPHL	VCC = 5 V, VO = 2.4 V, VI = 3.5 V, CL = 15 pF	-	10	-	ns
Power Dissipation	PD	Maximum continuous	-	-	100	mW
Operating Temperature Range	TA	-	-40	-	85	°C
Storage Temperature Range	TSTG	-	-65	-	150	°C

Instructions for Use:

1. Power Supply:

   • Ensure the supply voltage (V_CC) is within the range of 2.3 V to 5.5 V.
   • Use appropriate decoupling capacitors (typically 0.1 μF) close to the power pins to reduce noise and improve stability.

2. Input and Output Levels:

   • The device operates with standard TTL/CMOS logic levels.
   • Ensure input signals (V_IH, V_IL) are within the specified ranges to avoid undefined behavior.
   • Output signals (V_OH, V_OL) will be within the specified levels when the device is powered correctly.

3. Propagation Delay:

   • The propagation delay times (t_PLH, t_PHL) are critical for timing considerations in digital circuits. Ensure that these values are accounted for in your design to avoid timing issues.

4. Thermal Management:

   • The maximum power dissipation (P_D) should not exceed 100 mW under continuous operation.
   • If operating at high temperatures or in high-power applications, consider additional cooling measures such as heat sinks or forced air cooling.

5. Environmental Conditions:

   • The operating temperature range (T_A) is from -40°C to 85°C. Ensure the device is used within this range to maintain reliability.
   • The storage temperature range (T_STG) is from -65°C to 150°C. Store the device in a controlled environment to prevent damage.

6. Handling:

   • Handle the device with care to avoid static discharge, which can damage the internal circuitry.
   • Follow proper ESD (Electrostatic Discharge) precautions during handling and installation.

7. Mounting:

   • Ensure proper soldering techniques are used to avoid thermal stress and mechanical damage.
   • Verify the correct orientation of the device before soldering to prevent misconnections.

(For reference only)