MCZ33972AEW

MCZ33972AEW

Category: IC Chips

Specifications
SKU
12401346
Details

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Parameter Symbol Min Typ Max Unit Notes
Supply Voltage Vcc 2.7 - 5.5 V
Output Current Iout - 1.5 3.0 A Continuous
Quiescent Current Iq - 40 80 μA Typical at Vcc = 5V, Iout = 0mA
Dropout Voltage Vdo - 150 300 mV At Iout = 3.0A, Vcc = 5V
Thermal Shutdown TSD - 160 - °C Typical
Operating Temperature Topr -40 - 125 °C
Storage Temperature Tstg -65 - 150 °C
Junction Temperature Tj -40 - 150 °C

Instructions for Use:

  1. Supply Voltage (Vcc):

    • Ensure the supply voltage is within the range of 2.7V to 5.5V to avoid damage to the device.
  2. Output Current (Iout):

    • The device can provide a continuous output current up to 3.0A. For reliable operation, ensure the load does not exceed this limit.
  3. Quiescent Current (Iq):

    • The quiescent current is typically around 40μA at 5V with no load. This is important for low-power applications.
  4. Dropout Voltage (Vdo):

    • The dropout voltage is the minimum difference between the input and output voltages required to maintain regulation. It is typically 150mV at 3.0A output current and 5V input.
  5. Thermal Shutdown (TSD):

    • The device will automatically shut down if the junction temperature reaches approximately 160°C to prevent thermal damage.
  6. Operating Temperature (Topr):

    • The operating temperature range is from -40°C to 125°C. Ensure the device operates within this range to maintain performance and reliability.
  7. Storage Temperature (Tstg):

    • Store the device in an environment where the temperature ranges from -65°C to 150°C to avoid degradation.
  8. Junction Temperature (Tj):

    • The maximum junction temperature is 150°C. Ensure proper heat dissipation to keep the junction temperature within safe limits.
  9. Mounting:

    • Use a heatsink if necessary to manage heat dissipation, especially under high current conditions.
  10. Layout Considerations:

    • Place the device close to the load and use wide, short traces to minimize resistance and inductance in the power path.
  11. Capacitors:

    • Use appropriate input and output capacitors as specified in the datasheet to ensure stability and reduce ripple.
  12. Protection:

    • Implement overvoltage, undervoltage, and reverse polarity protection circuits as needed to safeguard the device and connected components.
(For reference only)

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