Details

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BUY SKKD212/16 https://www.utsource.net/itm/p/12401349.html

Parameter	Description	Value	Unit
Device Type	Description	Dual N-Channel Enhancement Mode MOSFET	-
VDS	Drain-to-Source Voltage	200	V
VGS	Gate-to-Source Voltage	±20	V
ID	Continuous Drain Current	16	A
RDS(on)	On-State Resistance at VGS = 10V	0.055	Ω
PTOT	Total Power Dissipation (Ta = 25°C)	160	W
TJ	Junction Temperature Range	-55 to +175	°C
TSTG	Storage Temperature Range	-55 to +175	°C
Qg	Total Gate Charge	90	nC
Vth	Threshold Voltage	2.0 to 4.0	V
EAS	Avalanche Energy (Single Pulse)	3.0	J

Instructions for Use:

1. Handling Precautions:

   • ESD Sensitive: Handle with care to avoid electrostatic discharge (ESD). Use grounded wrist straps and ESD-safe packaging.
   • Temperature Sensitivity: Ensure that the device is not exposed to temperatures outside its operating range during handling and storage.

2. Mounting:

   • Thermal Management: Ensure adequate heat sinking to manage the power dissipation, especially when operating at high currents.
   • Mechanical Stress: Avoid excessive mechanical stress on the leads and body of the device during soldering and assembly.

3. Soldering:

   • Temperature and Time: Use a soldering iron with a temperature setting no higher than 300°C and ensure that the soldering time does not exceed 10 seconds per lead.
   • Cooling: Allow the device to cool naturally after soldering to prevent thermal shock.

4. Electrical Connections:

   • Gate Protection: Consider using a gate resistor to limit current and protect the gate from overvoltage.
   • Decoupling Capacitors: Place decoupling capacitors close to the power supply pins to reduce noise and improve stability.

5. Testing:

   • Initial Testing: Perform initial testing under controlled conditions to verify proper operation and functionality.
   • Load Testing: Gradually increase the load to the rated current to ensure the device operates within specifications.

6. Storage:

   • Dry Conditions: Store the device in a dry environment to prevent moisture absorption.
   • Static Protection: Keep the device in ESD-protective packaging until ready for use.

7. Safety:

   • High Voltage: Be cautious when working with high voltages to avoid electrical shock.
   • Ventilation: Ensure proper ventilation in areas where the device is being used or tested to dissipate any generated heat.

(For reference only)