Details

---

BUY HCPL-7840-500E A7840 HCPL7840 DIP8 https://www.utsource.net/itm/p/12401357.html

Parameter	Symbol	Min	Typ	Max	Unit
Input Current (Forward)	IF	10	20	30	mA
Input Voltage (Forward)	VF	1.1	1.3	1.5	V
Output Current (Continuous)	IO	-	50	-	mA
Output Voltage (Open Collector)	VCE(sat)	-	0.3	-	V
Isolation Voltage	VIORM	-	5000	-	Vrms
Propagation Delay Time	tPLH, tPHL	-	100	-	ns
Storage Temperature	Tstg	-40	-	125	掳C
Operating Temperature	Topr	-40	-	85	掳C

Instructions for HCPL-7840-500E A7840 HCPL7840 DIP8:

1. Power Supply:

   • Ensure the input and output power supplies are within the specified voltage ranges.
   • Use a stable power supply to avoid fluctuations that could affect performance.

2. Input Signal:

   • Apply the input signal with a forward current (IF) between 10 mA and 30 mA.
   • The forward voltage (VF) should be between 1.1 V and 1.5 V.

3. Output Configuration:

   • Connect the output to a load that can handle up to 50 mA of continuous current.
   • Ensure the output voltage (VCE(sat)) is no more than 0.3 V when the output is active.

4. Isolation:

   • The device provides an isolation voltage (VIORM) of up to 5000 Vrms. Ensure that the input and output circuits are properly isolated to prevent electrical hazards.

5. Timing:

   • The propagation delay time (tPLH, tPHL) is typically 100 ns. Design your circuit to account for this delay to ensure proper operation.

6. Temperature Considerations:

   • Store the device in an environment with temperatures ranging from -40掳C to 125掳C.
   • Operate the device within the temperature range of -40掳C to 85掳C to ensure reliable performance.

7. Handling:

   • Handle the device with care to avoid static discharge, which can damage the internal components.
   • Follow proper soldering techniques to ensure good electrical connections and to prevent thermal damage.

8. Mounting:

   • Mount the device on a PCB using standard through-hole mounting techniques.
   • Ensure that the pins are securely soldered and aligned correctly to avoid mechanical stress.

9. Testing:

   • Test the device after installation to verify that it meets the specified parameters and operates correctly in your application.

10. Compliance:

    • Ensure that your design complies with relevant safety and regulatory standards, especially if the device is used in safety-critical applications.

(For reference only)