Details

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BUY GSL1680 https://www.utsource.net/itm/p/12401660.html

Parameter	Description	Value
Device Type	Type of device	Dual Channel 20V 5A Load Switch with I2C Control
Supply Voltage (VDD)	Operating voltage range	1.8V to 20V
Output Current (IOUT)	Maximum continuous output current per channel	5A (each channel)
Channel Configuration	Number of channels	2 (Independent)
Control Interface	Communication protocol	I2C (2-wire serial interface)
I2C Address	Default I2C address	0x40 (7-bit)
Operating Temperature Range	Temperature range for operation	-40掳C to +85掳C
Storage Temperature Range	Temperature range for storage	-65掳C to +150掳C
Package	Package type	QFN-16 (4x4mm)
Quiescent Current (IQ)	Typical quiescent current	10渭A (per channel)
Shutdown Current (ISD)	Typical shutdown current	0.1渭A (per channel)
RDS(ON)	On-state resistance	5m惟 (max) at VGS = 4.5V, 25掳C
Protection Features	Built-in protection features	Overcurrent, Overtemperature, Short-circuit
Power Dissipation	Maximum power dissipation	1.5W (derated above 70掳C)

Instructions

1. Power Supply Connection:

   • Connect the VDD pin to the power supply voltage within the range of 1.8V to 20V.
   • Ensure the GND pin is connected to the ground.

2. I2C Communication:

   • Connect the SDA and SCL pins to the I2C bus lines.
   • Use the default I2C address 0x40 or configure it as needed.

3. Channel Control:

   • Use the I2C commands to control the on/off state of each channel.
   • Command format: Write to the control register (address 0x00) with the appropriate bit settings for each channel.

4. Reading Status:

   • Read the status register (address 0x01) to check the current state of the channels and any fault conditions.

5. Protection:

   • The device includes overcurrent, overtemperature, and short-circuit protection. In case of a fault, the affected channel will automatically shut down.
   • Check the status register to identify and clear faults.

6. Thermal Management:

   • Ensure adequate heat dissipation if operating at high currents or in high ambient temperatures.
   • Refer to the power dissipation limits and derating curves in the datasheet.

7. Layout Considerations:

   • Place the device close to the load to minimize trace inductance and improve transient response.
   • Use a ground plane to enhance thermal performance and reduce noise.

8. Storage and Handling:

   • Store the device in a dry environment to prevent moisture damage.
   • Handle with care to avoid static discharge and physical damage.

(For reference only)